3D Integration and Advanced Packaging for Modular Quantum Computer based on Diamond Spin Qubits

Activity: Talk or presentationTalk or presentation at a workshop, seminar, course or other meeting

Description

Invited talk at the workshop 3D Integration: Heterogeneous 3D Architectures and Sensors
Period19 Apr 2023
Event titleDATE 2023
Event typeConference
LocationAntwerp, Belgium
Degree of RecognitionInternational