3D Integration Technology for Modular Quantum Computer

Activity: Talk or presentationTalk or presentation at a workshop, seminar, course or other meeting

Description

Quantum computer chip based on spin qubits in diamond uses modules that are entangled with on-chip optical links. This modular quantum computer architecture enables a negligible crosstalk, increased connectivity, and a high fidelity when the number of qubits increases. Here, 3D integration is the key enabling technology as it features heterogenous integration of photonic and CMOS circuits for routing, control and readout of the qubits. Several engineering challenges exist in order to integrate the large number of spins in diamond with the on-chip circuits operating at a cryogenic temperature. I will review those challenges, present recent results and discuss future outlook of the integration technology for the realization of a scalable quantum computer based on diamond spin qubits.
Period18 May 2022
Held atQuTech, Netherlands
Degree of RecognitionInternational