Past, present and future of stacked CIS

Activity: Talk or presentation › Talk or presentation at a workshop, seminar, course or other meeting

Period19 Sept 2022
Event titleESSCIRC-ESSDERC Workshop “Wafer-level 3D Stacked Imagers : Technologies and Sensors Architectures"
Event typeWorkshop
LocationMilano, ItalyShow on map
Degree of RecognitionInternational