Research output per year
Research output per year
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Dive into the research topics where Electronic Components, Technology and Materials is active. These topic labels come from the works of this organisation's members. Together they form a unique fingerprint.
Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
Profiles
Research output
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3D Parametric Simulations of Mass Transport and Mechanical Properties of a Microfluidic Barrier-on-Chip Device
De Jong, S. D. M., Tawade, P. V., Mastrangeli, M. & Van Driel, W. D., 2026, Proceedings - 2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2026. IEEE, (Proceedings - 2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2026).Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review
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A -102.2dB THD+N, 92% Efficiency, 1.08mW Idle Power Digital-Input Class-D Amplifier with Power-Adaptive Techniques and Dual-Edge Pulse-Width Adjustment Modulator
Zhang, M., Zhang, H., Lombardo, D. M. & Fan, Q., 2026, 2026 IEEE International Solid-State Circuits Conference, ISSCC 2026. IEEE, p. 78-80 3 p. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 69).Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review
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A -82.3dB THD+N 60V Fully Integrated Shunt-Resistor-Based In-Line Current Sensor with DLL-Assisted Dynamic Body-Biasing Technique
Ma, H., Zhang, H. & Fan, Q., 2026, 2026 IEEE International Solid-State Circuits Conference, ISSCC 2026. Piscataway, NJ, USA: IEEE, p. 380-382 3 p. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 69).Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review
Datasets
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Codes and data associated with the processing of the pre-charged CMUT characterisation
Saccher, M. (Creator), TU Delft - 4TU.ResearchData, 19 Mar 2024
DOI: 10.4121/E363FBD3-C8C2-4BDE-B91E-530838CD194A
Dataset/Software: Dataset
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Codes and data associated with the ultrasonic power transfer simulations and experimental data.
Saccher, M. (Creator), TU Delft - 4TU.ResearchData, 19 Mar 2024
DOI: 10.4121/79C469BC-6F92-45AF-84F2-7B520321DA3E
Dataset/Software: Dataset
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Video recording showing ultrasonic powering of a fracture monitor demonstrator prototype
Saccher, M. (Creator), TU Delft - 4TU.ResearchData, 8 Mar 2024
DOI: 10.4121/A666ADB6-8351-43A4-9742-D25B33C25510
Dataset/Software: Dataset
Prizes
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2022 Micro and Nano Engineering Journal, Young Investigator Award and Lectureship
Vollebregt, S. (Recipient), 2022
Prize: Prize (including medals and awards)
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Dow Energy dissertation prize 2011
Neo, W. (Recipient), 2011
Prize: Prize (including medals and awards)
Activities
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Microengineering organs-on-chip
Mastrangeli, M. (Invited speaker)
3 Jun 2020Activity: Talk or presentation › Talk or presentation at a workshop, seminar, course or other meeting
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Microengineering organs-on-chip
Mastrangeli, M. (Invited speaker)
3 Jun 2020Activity: Talk or presentation › Talk or presentation at a workshop, seminar, course or other meeting
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Microengineering organs-on-chip
Mastrangeli, M. (Invited speaker)
3 Jun 2020Activity: Talk or presentation › Talk or presentation at a workshop, seminar, course or other meeting
Press/Media
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EXPLAIN project brings explainable, trustworthy and human-centred AI to industry
van Driel, W. D., Dauwels, J. H. G. & Ghorbani Ghezeljehmeidan, A.
16/09/25
2 items of Media coverage
Press/Media: Public Engagement
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Realizing the materials of the future, one atomic layer at a time
30/04/25
1 item of Media coverage, 1 Media contribution
Press/Media: Public Engagement
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NWO OTP financiering voor een Silicium Carbide gassensorchip
French, P. J., Sarro, P. M. & Vollebregt, S.
18/09/24
1 item of Media coverage, 1 Media contribution
Press/Media: Public Engagement