Electronic Components, Technology and Materials

Research Output

2018

Hydrogen sulfide detection properties of Pt-gated AlGaN/GaN HEMT-sensor

Sokolovskij, R., Zhang, J., Iervolino, E., Zhao, C., Santagata, F., Wang, F., Yu, H., Sarro, P. M. & Zhang, G. Q., 2018, In : Sensors and Actuators, B: Chemical. 274, p. 636-644 9 p.

Research output: Contribution to journalArticleScientificpeer-review

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8 Citations (Scopus)
2 Downloads (Pure)

Imaging Correlations in Heterodyne Spectra for Quantum Displacement Sensing

Pontin, A., Lang, J. E., Chowdhury, A., Vezio, P., Marino, F., Morana, B., Serra, E., Marin, F. & Monteiro, T. S., 2018, In : Physical Review Letters. 120, 2, p. 1-6 6 p., 020503.

Research output: Contribution to journalArticleScientificpeer-review

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5 Citations (Scopus)
13 Downloads (Pure)

Influence of Pressure on the Mechanical and Electronic Properties of Wurtzite and Zinc-Blende GaN Crystals

Qin, H., Kuang, T., Luan, X., Li, W., Xiao, J., Zhang, P., Yang, D. & Zhang, G., 2018, In : Crystals. 8, 11, 16 p., 428.

Research output: Contribution to journalArticleScientificpeer-review

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14 Downloads (Pure)

In Situ  Failure Detection of Electronic Control Units Using Piezoresistive Stress Sensor

Prisacaru, A., Palczynska, A., Theissler, A., Gromala, P., Han, B. & Zhang, G. Q., 2018, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 8, 5, p. 750-763 14 p.

Research output: Contribution to journalArticleScientificpeer-review

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2 Citations (Scopus)
11 Downloads (Pure)

Interfacial Failure Characterization of Electronic Packaging Component Using a Multiscale Modelling Approach

Cui, Z., Zhang, Y., Yang, Q., Zhang, G. & Chen, X., 2018, Proceedings - 2018 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2018. Piscataway, NJ: IEEE, p. 68-70 3 p. 8421434

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
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19 Downloads (Pure)

Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages

Cui, Z., Chen, X., Fan, X. & Zhang, G., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-4 4 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
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13 Downloads (Pure)

Internal stress state of TQFP subjected to liquid thermal shock using piezoresistive silicon stress sensor

Prisacaru, A., Sun, Y., Gromala, P. J., Han, B. & Zhang, G. Q., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-3 3 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Investigation of "fur-like" residues post dry etching of polyimide using aluminum hard etch mask

Joshi, S., Savov, A., Shafqat, S. & Dekker, R., 2018, In : Materials Science in Semiconductor Processing. 75, p. 130-135 6 p.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
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3 Citations (Scopus)
44 Downloads (Pure)

LED-Based Luminaire Color Shift Acceleration and Prediction

Lu, G., van Driel, W. D. (ed.), Fan, X., Fan, J. & Zhang, G. Q., 2018, Solid State Lighting Reliability Part 2: Components to Systems. van Driel, W. D., Fan, X. & Zhang, G. Q. (eds.). 1 ed. Cham: Springer, p. 201-219 19 p. (Solid State Lighting Technology and Application Series; vol. 3).

Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

Lightning Effects on LED-Based Luminaires

Agbemuko, A., van Meurs, J. & van Driel, W. D., 2018, Solid State Lighting Reliability Part 2: Components to Systems. van Driel, W. D., Fan, X. & Zhang, G. Q. (eds.). 1 ed. Cham: Springer, p. 573-583 11 p. (Solid State Lighting Technology and Application Series; vol. 3).

Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

Lumen maintenance prediction for LEDs: New insights

Jacobs, B., van Driel, W. D. & Schuld, M., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-4 4 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
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14 Downloads (Pure)

Making large free-standing multi-layer graphene/graphitic membranes

Kurganova, E., Giesbers, A. J. M., Vollebregt, S., Notenboom, A., Vles, D., Nasalevich, M. & van Zwol, P., 2018, p. 1-1. 1 p.

Research output: Contribution to conferenceAbstractScientific

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20 Downloads (Pure)

MEMS-based multi-modal vibration energy harvesters for ultra-low power autonomous remote and distributed sensing

Iannacci, J., Serra, E., Sordo, G., Bonaldi, M., Borrielli, A., Schmid, U., Schneider, M., Pandraud, G., Sarro, P. M. & More Authors, 2018, In : Microsystem Technologies. 24, 12, p. 5027-5036 10 p.

Research output: Contribution to journalArticleScientificpeer-review

3 Citations (Scopus)

Microfabricated tuneable and transferable porous PDMS membranes for Organs-on-Chips

Quirós-Solano, W. F., Gaio, N., Stassen, O. M. J. A., Arik, Y. B., Silvestri, C., Van Engeland, N. C. A., Van der Meer, A., Passier, R., Sahlgren, C. M., Bouten, C. V. C., van den Berg, A., Dekker, R. & Sarro, P. M., 2018, In : Scientific Reports. 8, p. 1-11 11 p., 13524.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
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6 Citations (Scopus)
55 Downloads (Pure)

Microstructure and hardness of SAC305 and SAC305-0.3Ni solder on Cu, high temperature treated Cu, and graphene-coated Cu substrates

Li, S., Liu, Y., Zhang, H., Cai, H., Sun, F. & Zhang, G., 2018, In : Results in Physics. 11, p. 617-622 6 p.

Research output: Contribution to journalArticleScientificpeer-review

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4 Citations (Scopus)
45 Downloads (Pure)

Microstructure and hardness of SAC305-xNi solder on Cu and graphene-coated Cu substrates

Liu, Y., Li, S., Zhang, H., Cai, H., Sun, F. & Zhang, G., 2018, In : Journal of Materials Science: Materials in Electronics. 29, 15, p. 13167-13175 9 p.

Research output: Contribution to journalArticleScientificpeer-review

4 Citations (Scopus)

Microstructure and mechanical properties of spark plasma sintered nanocrystalline Ni3Al-xB (0.0<x<1.5 at%) alloy

Mohammadnejad, A., Bahrami, A., Sajadi, M., Karimi, P., Fozveh, H. R. & Mehr, M. Y., 2018, In : Materials Today Communications. 17, p. 161-168 8 p.

Research output: Contribution to journalArticleScientificpeer-review

9 Citations (Scopus)

Modeling of Two-Dimensional Hyperbolic Heat Conduction in Silicon-On-Insulator Transistor by Equivalent RLC Network

Mirza Gheytaghi, A., Zhang, G. Q. & Ye, H., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-5 5 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Modulation of Gas Adsorption on SnS by strain

Hu, F., Ye, H., Tang, H. & Chen, X., 2 Oct 2018, Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018. Xiao, F., Wang, J., Chen, L. & Ye, T. (eds.). Piscataway, NJ: IEEE, p. 941-943 3 p. 8480834

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

1 Citation (Scopus)

Non-linear bulk micromachined accelerometer for high sensitivity applications

Middelburg, L. M., Mansouri, B. E., Poelma, R., Zhang, G. Q., van Zeijl, H. & Wei, J., 2018, 2018 IEEE SENSORS Proceedings. Roy, A. & Gianchandani, Y. (eds.). Piscataway, NJ: IEEE, Vol. 2018-October. p. 1-4 4 p. 8589630

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
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51 Downloads (Pure)

Normal-Mode Splitting in a Weakly Coupled Optomechanical System

Rossi, M., Kralj, N., Zippilli, S., Natali, R., Borrielli, A., Pandraud, G., Serra, E., Di Giuseppe, G. & Vitali, D., 2018, In : Physical Review Letters. 120, 7, p. 1-5 5 p., 073601.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
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23 Citations (Scopus)
61 Downloads (Pure)

Promoting sensitivity and selectivity of HCHO sensor based on strained InP3 monolayer: A DFT study

Yang, H., Wang, Z., Ye, H., Zhang, K., Chen, X. & Zhang, G., 2018, In : Applied Surface Science. 459, p. 554-561 8 p.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
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7 Citations (Scopus)
2 Downloads (Pure)

Quality and Reliability in Solid-State Lighting: Qua Vadis?

Vos, T., den Breeijen, P. & van Driel, W. D., 2018, Solid State Lighting Reliability Part 2: Components to Systems. van Driel, W. D., Fan, X. & Zhang, G. Q. (eds.). 1 ed. Cham: Springer, p. 1-13 13 p. (Solid State Lighting Technology and Application Series; vol. 3).

Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

Quantum nondemolition measurement of optical field fluctuations by optomechanical interaction

Pontin, A., Bonaldi, M., Borrielli, A., Marconi, L., Marino, F., Pandraud, G., Prodi, G. A., Sarro, P. M., Serra, E. & Marin, F., 2018, In : Physical Review A. 97, 3, 033833.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
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6 Citations (Scopus)
52 Downloads (Pure)

Reliability and Lifetime Assessment of Optical Materials in LED-Based Products

Yazdan Mehr, M., van Driel, W. & Zhang, G. Q., 2018, Solid State Lighting Reliability Part 2: Components to Systems. van Driel, W. D., Fan, X. & Zhang, G. Q. (eds.). 1 ed. Cham: Springer, p. 115-139 25 p. (Solid State Lighting Technology and Application Series; vol. 3).

Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientificpeer-review

Reliability Prediction of Integrated LED Lamps with Electrolytic Capacitor-Less LED Drivers

Sun, B., Fan, X., van Driel, W. D. (ed.) & Zhang, G. Q., 2018, Solid State Lighting Reliability Part 2: Components to Systems. van Driel, W. D., Fan, X. & Zhang, G. Q. (eds.). 1 ed. Cham: Springer, p. 455-486 32 p. (Solid State Lighting Technology and Application Series; vol. 3).

Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

SiC MOSFET Threshold-Voltage Instability under High Temperature Aging

Liu, Y., Chen, X., Zhao, Z., Li, Z., Lu, C., Zhang, J., Ye, H., Koh, S. W., Wang, L. & Zhang, G., 2018, Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018. Xiao, F., Wang, J., Chen, L. & Ye, T. (eds.). Piscataway, NJ: IEEE, p. 347-350 4 p. 8480781

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Silicon Nitride MOMS Oscillator for Room Temperature Quantum Optomechanics

Serra, E., Morana, B., Borrielli, A., Marin, F., Pandraud, G., Pontin, A., Prodi, G. A., Sarro, P. M. & Bonaldi, M., 2018, In : Journal of Microelectromechanical Systems. 27, 6, p. 1193-1203 11 p., 8520914.

Research output: Contribution to journalArticleScientificpeer-review

4 Citations (Scopus)

Solid State Lighting Reliability Part 2: Components to Systems

van Driel, W. (ed.), Fan, X. (ed.) & Zhang, G. Q. (ed.), 2018, 1 ed. Cham: Springer. 606 p. (Solid State Lighting Technology and Application Series; vol. 3)

Research output: Book/ReportBook editingScientific

Statistical Analysis of Lumen Depreciation for LED Packages

Schuld, M., van Driel, W. D. (ed.) & Jacobs, B., 2018, Solid State Lighting Reliability Part 2: Components to Systems. van Driel, W. D., Fan, X. & Zhang, G. Q. (eds.). 1 ed. Cham: Springer, p. 487-502 16 p. (Solid State Lighting Technology and Application Series; vol. 3).

Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

Study of ultraviolet assisted cure mechanism of the phosphor/silicone composites used in White LEDs

Wang, Z., Fan, J., Liu, J., Hu, A., Qian, C., Fan, X. & Zhang, G., 2018, Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018. Xioa, F., Wang, J., Chen, J. & Ye, T. (eds.). Piscataway, NJ: IEEE, p. 525-530 6 p. 8480566

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

2 Citations (Scopus)

Study on the Degradation of Optical Silicone Exposed to Harsh Environments

Yazdan Mehr, M., van Driel, W., De Buyl, F. & Zhang, G. Q., 2018, In : Materials. 11, 8, p. 1-10 10 p., 1305.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
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5 Citations (Scopus)
16 Downloads (Pure)

Surface Acoustic Mode Aluminum Nitride Transducer for micro-size liquid sensing applications

Bui, T. H., 2018, 135 p.

Research output: ThesisDissertation (TU Delft)

Open Access
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11 Downloads (Pure)

System in package (SiP) technology: Fundamentals, design and applications

Santagata, F., Sun, J., Iervolino, E., Yu, H., Wang, F., Zhang, G., Sarro, P. M. & Zhang, G., 2018, In : Microelectronics International. 35, 4, p. 231-243 13 p.

Research output: Contribution to journalArticleScientific

5 Citations (Scopus)

The effects of graphene stacking on the performance of methane sensor: A first-principles study on the adsorption, band gap and doping of graphene

Yang, N., Yang, D., Zhang, G., Chen, L., Liu, D., Cai, M. & Fan, X., 2018, In : Sensors. 18, 2, p. 1+13 13 p., 422.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
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4 Citations (Scopus)
19 Downloads (Pure)

The Next Frontier: Reliability of Complex Systems

Schenkelaars, D., van Driel, W. D. (ed.) & Duijve, R., 2018, Solid State Lighting Reliability Part 2: Components to Systems. van Driel, W. D., Fan, X. & Zhang, G. Q. (eds.). 1 ed. Cham: Springer, p. 585-595 11 p. (Solid State Lighting Technology and Application Series; vol. 3).

Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

The performance of sintered nanocopper interconnections for high temperature device

Liu, Q., Chen, X., Zhu, J., Zhang, H., Zhang, J. S., Zhang, J. G., Wang, L., Ye, H., Koh, S. W. & Zhang, G. O., 2018, Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018. Xiao, F., Wang, J., Chen, L. & Ye, T. (eds.). Piscataway, NJ: IEEE, p. 1476-1478 3 p. 8480591

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

2 Citations (Scopus)

Thermal Management on IGBT Power Electronic Devices and Modules

Qian, C., Mirza Gheytaghi, A., Fan, J., Tang, H., Sun, B., Ye, H. & Zhang, G., 2018, In : IEEE Access. 6, p. 12868-12884 16 p.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
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46 Citations (Scopus)
849 Downloads (Pure)

Ultra-thin alumina and silicon nitride MEMS fabricated membranes for the electron multiplication

Prodanović, V., Chan, H. W., van der Graaf, H. & Sarro, P. M., 2018, In : Nanotechnology. 29, 15, p. 1-11 11 p., 155703.

Research output: Contribution to journalArticleScientificpeer-review

3 Citations (Scopus)

Vacuum assisted liquified metal (VALM) TSV filling method with superconductive material

Alfaro, J. A., Sberna, P. M., Silvestri, C., Mastrangeli, M., Ishihara, R. & Sarro, P. M., 2018, 31st IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2018): Belfast, Northern Ireland. Piscataway, NJ: IEEE, Vol. 2018-January. p. 547-550 4 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
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2 Citations (Scopus)
22 Downloads (Pure)

Versatile 3D Stretchable Micro-Environment for Organ-on-Chip Devices Fabricated with Standard Silicon Technology

Gaio, N. & Quiros Solano, W., 2018, IPC No. B01L, Priority date 25 Jul 2016, Priority No. WO 2018021906 A1

Research output: Patent

Wafer Level Through Polymer Optical Vias (TPOV) Enabling High Throughput of Optical Windows Manufacturing

Huang, Z. Q., Poelma, R. H., Vollebregt, S., Koelink, M. H., Boschman, E., Kropf, R., Gallouch, M. & Zhang, G. Q., 2018, 2018 7th Electronic System-Integration Technology Conference (ESTC). IEEE, p. 1-5 5 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
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27 Downloads (Pure)

Wafer-Scale Integration for Semi-Flexible Neural Implant Miniaturization

Kluba, M., Morana, B., Savov, A., van Zeijl, H., Pandraud, G. & Dekker, R., 2018, In : Proceedings. 2, 13, 5 p., 941.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
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3 Downloads (Pure)
2017

A Bluetooth Low-Energy Transceiver with 3.7-mW All-Digital Transmitter, 2.75-mW High-IF Discrete-Time Receiver, and TX/RX Switchable On-Chip Matching Network

Kuo, F-W., Binsfeld Ferreira, S., Chen, H-N. R., Cho, L-C., Jou, C-P., Hsueh, F-L., Madadi, I., Tohidian, M., Shahmohammadi, M., Babaie, M. & Staszewski, R. B., 2017, In : IEEE Journal of Solid State Circuits. 52, 4, p. 1144-1162 19 p., 7862859.

Research output: Contribution to journalArticleScientificpeer-review

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51 Citations (Scopus)
335 Downloads (Pure)

An innovative approach to overcome saturation and recovery issues of CVD graphene-based gas sensors

Ricciardella, F., Vollebregt, S., Polichetti, T., Alfano, B., Massera, E. & Sarro, L., 2017, Proceedings of IEEE Sensors Conference 2017. Piscataway, NJ: IEEE, p. 1-3 3 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
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3 Citations (Scopus)
14 Downloads (Pure)

A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation

Sun, B., Fan, X., Ye, H., Fan, J., Qian, C., van Driel, W. & Zhang, G. Q., 1 Jul 2017, In : Reliability Engineering & System Safety. 163, p. 14-21 8 p.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
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16 Citations (Scopus)
21 Downloads (Pure)

A PoF and statistics combined reliability prediction for LED arrays in lamps

Sun, B., Fan, X., Fan, J., Zhang, G. Q. & Qian, C., 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. Piscataway, NJ: IEEE, p. 1-5 5 p. 7926264

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
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1 Citation (Scopus)
15 Downloads (Pure)

A Reliability Prediction for Integrated LED Lamp with Electrolytic Capacitor-Free Driver

Sun, B., Fan, X., Li, L., Ye, H., van Driel, W. & Zhang, G. Q., 2017, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 7, 7, p. 1081-1088 8 p., 7935411.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
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6 Citations (Scopus)
13 Downloads (Pure)