Electronic Components, Technology and Materials

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2020

Enabling actuation and sensing in organs-on-chip using electroactive polymers

Motreuil-Ragot, P. A., Hunt, A., Kasi, D., Brajon, B., van den Maagdenberg, A. M. J. M., Orlova, V., Mastrangeli, M. & Sarro, P. M., 15 Jun 2020, 3rd IEEE International Conference on Soft Robotics (RoboSoft 2020). p. 530-535

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Fabrication of Al-based superconducting high-aspect ratio TSVs for quantum 3D integration

Alfaro Barrantes, J., Mastrangeli, M., Thoen, D., Bueno Lopez, J., Baselmans, J. & Sarro, L., 1 Jan 2020, 33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020. Vol. 2020-January. p. 932-935 4 p. 9056165

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Impedance Spectroscopy for Enhanced Data Collection of Conductometric Soot Sensors

Middelburg, L. M., Ghaderi, M., Bilby, D., Visser, J. H., Zhang, K. & Wolffenbuttel, R. F., 2020, 2020 IEEE 29th International Symposium on Industrial Electronics (ISIE). IEEE, p. 1099-1103 5 p. 9152484

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Implementation of General Coupling Model of Electromigration in ANSYS

Cui, Z., Fan, X. & Zhang, G., 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC). O'Conner, L. & Torres, H. (eds.). Piscataway: IEEE, p. 1632-1637 6 p. 9159445

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PDMS-Parylene Adhesion Improvement via Ceramic Interlayers to Strengthen the Encapsulation of Active Neural Implants

Bakhshaee Babaroud, N., Dekker, R., Serdijn, W. & Giagka, V., 2020, 2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC): Proceedings. Danvers: IEEE, p. 3399-3402 4 p. 9175646

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Self-Cleaning Micro-Windows for In-Tailpipe Optical Exhaust Gas Measurements

Ghaderi, A., Middelburg, L. M., Bilby, D., Visser, J. H., Lundgren, P., Enoksson, P. & Wolffenbuttel, R. F., 2020, 2020 IEEE 29th International Symposium on Industrial Electronics, ISIE 2020 - Proceedings. IEEE, p. 1104-1108 5 p. 9152437. (IEEE International Symposium on Industrial Electronics; vol. 2020-June).

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

System Software Reliability

van Driel, W. D., Bikker, J. W. & Tijink, M., 2020, 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE): Proceedings. IEEE, p. 1-5 5 p. 9152686

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Wafer Scale Flexible Interconnect Transfer for Hetrogeneous Integration

Liu, P., Li, J., van Zeijl, H. & Zhang, G., 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC): Proceedings. O'Conner, L. (ed.). Piscataway: IEEE, p. 817-823 7 p. 9159329

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2019

A Novel Partial Carrier Stored and Hole Path IGBT for Ultralow Turn-Off Loss and On-State Voltage With High EMI Noise Controllability

Wang, S., Tan, C., Wang, L., Luo, H., Zhang, G. & Chen, X., 1 Mar 2019, 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019. IEEE, p. 410-412 3 p. 8731110

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

A SPICE-based transient thermal-electronic model for LEDs

Sun, B., Fan, J., Fan, X. & Zhang, G., 1 Mar 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. IEEE, p. 1-5 5 p. 8724555

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A Wafer-Scale Process for the Monolithic Integration of CVD Graphene and CMOS Logic for Smart MEMS/NEMS Sensors

Romijn, J., Vollebregt, S., van Zeijl, H. W. & Sarro, P. M., 2019, 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems (MEMS). Piscataway: IEEE, p. 260-263 4 p. 8870741

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1 Citation (Scopus)
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Degradation of bisphenol-a-polycarbonate (BPA-PC) optical lenses under simulated harsh environment conditions

Mehr, M. Y., Van Driel, W. & Zhang, K., 1 Mar 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. Institute of Electrical and Electronics Engineers (IEEE), p. 1-4 4 p. 8724524

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Degradation Prediction of Electronic Packages using Machine Learning

Prisacaru, A., Guerrero, E. O., Gromala, P. J., Han, B. & Zhang, G. Q., 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. IEEE, p. 1-9 9 p. 8724523

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Effect of Signals on the Encapsulation Performance of Parylene Coated Platinum Tracks for Active Medical Implants

Nanbakhsh, K., Kluba, M., Pahl, B., Bourgeois, F., Dekker, R., Serdijn, W. & Giagka, V., 26 Jul 2019, 2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC). Danvers: IEEE, p. 3840-3844 5 p.

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Electrical and optical characterization of MoS2 thin film transistors and the effect of strain on their performances

Qu, Z., Tang, H., Ye, H., Fan, X. & Zhang, G., 1 Mar 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. IEEE, p. 1-5 5 p. 8724549

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Lifetime prediction of ultraviolet light-emitting diodes with accelerated wiener degradation process

Jing, Z., Ibrahim, M. S., Fan, J., Fan, X. & Zhang, G., 1 Mar 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. IEEE, p. 1-8 8 p. 8724571

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

MEMS Enabled Fast Time-Resolved X-Ray Diffraction Characterization Platform for Copper Nanoparticle Sintering in Heterogeneous Integration Applications

Zhang, B., Wei, J., Bottger, A. J., van Zeijl, H. W., Sarro, P. M. & Zhang, G., 2019, 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII): Proceedings. Danvers: IEEE, p. 1772-1775 4 p. 8808192

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Novel Two-dimensional Semiconductor Monolayer SnP2 with Tunable Bandgap

Zhang, Y., Tao, L., Li, X., Zhang, G. & Chen, X., 1 Mar 2019, 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019. IEEE, p. 276-278 3 p. 8731255

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Pressure measurement of geometrically curved ultrasound transducer array for spatially specific stimulation of the vagus nerve

Kawasaki, S., Giagka, V., de Haas, M., Louwerse, M., Henneken, V., van Heesch, C. & Dekker, R., 2019, 2019 9th International IEEE/EMBS Conference on Neural Engineering. IEEE, p. 1239-1242 4 p.

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2018

A highly miniturized single-chip MOEMS scanner for all-in-one imaging solution

Jovic, A., Uto, T., Hei, K., Sancho, J., Sanchez, N., Zinoviev, K., Rubio, J. L., Margallo, E., Pandraud, G. & Sarro, P. M., 2018, 2018 IEEE Micro Electro Mechanical Systems, MEMS 2018. Piscataway, NJ: IEEE, Vol. 2018-January. p. 25-28 4 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

AlGaN/GaN HEMT micro-sensor technology for gas sensing applications

Sokolovskij, R., Zhang, J., Jiang, Y., Chen, G., Zhang, G. Q. & Yu, H., 2018, ICSICT-2018 - 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) Proceedings. Jiang, Y-L., Tang, T-A. & Ye, F. (eds.). Piscataway, NJ: IEEE, p. 1-4 4 p. 8564904

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A miniaturized low power Pirani pressure sensor based on suspended graphene

Romijn, J., Vollebregt, S., Dolleman, R. J., Singh, M., van der Zant, H. S. J., Steeneken, P. & Sarro, P., 2018, Proceedings of the 13th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems. Piscataway, NJ: IEEE, p. 11-14 4 p.

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5 Citations (Scopus)
25 Downloads (Pure)

A multiwell plate Organ-on-Chip (OOC) device for in-vitro cell culture stimulation and monitoring

Gaio, N., Waafi, A., Vlaming, M. L. H., Boschman, E., Dijkstra, P., Nacken, O., Braam, S. R., Boucsein, C., Sarro, P. M. & Dekker, R., 2018, 2018 IEEE Micro Electro Mechanical Systems, MEMS 2018. Piscataway, NJ: IEEE, Vol. 2018-January. p. 314-317 4 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

3 Citations (Scopus)

A novel method to transfer porous PDMS membranes for high throughput Organ-on-Chip and Lab-on-Chip assembly

Quiros-Solano, W. F., Gaio, N., Silvestri, C., Arik, Y. B., Stassen, O. M. J. A., van der Meer, A. D., Bouten, C. V. C., van den Berg, A., Dekker, R. & Sarro, P. M., 2018, 2018 IEEE Micro Electro Mechanical Systems, MEMS 2018. Piscataway, NJ: IEEE, Vol. 2018-January. p. 318-321 4 p.

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A probabilistic physics-of-failure reliability assessment approach for integrated LED lamps

Sun, B., Fan, J., Fan, X. & Zhang, G., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-5 5 p.

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1 Citation (Scopus)
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A tunable THz wave modulator based on graphene

Zhang, F., Chen, X-P., Wei, Q., Yuan, L-B., Cai, M., Ye, H-Y., Zhang, G-Q. & Xiao, J., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-4 4 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

1 Citation (Scopus)

Au-based and Au-free Ohmic Contacts to AlGaN/GaN Structures on Silicon or Sapphire Substrates

Li, W., Zhang, J., Sokolovskij, R., Zhu, Y., Qi, Y., Lin, X., Wu, J., Jiang, L. & Yu, H., 2018, 2018 18th International Workshop on Junction Technology, IWJT-2018: Extended Abstracts. Jiang, Y-L., Qu, X-P., Ru, G-P. & Li, B-Z. (eds.). Piscataway, NJ: IEEE, Vol. 2018-January. p. 1-4 4 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Color maintenance prediction for LED-based products

van Driel, W. D., Beijer, J. G. J., Bikker, J. W., van Blokland, C. H. M., Ankomah, C. & Jacobs, B., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-6 6 p.

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Compensation Method for Die Shift in Fan-Out Packaging

Sun, Y., Hou, F., Chen, F., Liu, H., Zhang, H., Sun, P., Lin, T. & Cao, L., 2018, 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018: Proceedings . Ye, T., Xiao, F., Wang, J. & Chen, L. (eds.). Piscataway: IEEE, p. 1681-1686 6 p. 8480551

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1 Citation (Scopus)

Designing a 100 [aF/nm] capacitive transducer

Middelburg, L. M., Mansouri, B. E., Poelma, R. H., Van Zeijl, H. W., Wei, J., Zhang, G. Q. & Van Driel, W. D., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-3 3 p.

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Fatigue Damage Assessment of LED Chip Scale Packages with Finite Element Simulation

Fan, J., Hu, A., Pecht, M., Chen, W., Fan, X., Xu, D. & Zhang, G., 2018, Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018. Xiao, F., Wang, J., Chen, L. & Ye, T. (eds.). Piscataway, NJ: IEEE, p. 1642-1648 7 p. 8480748

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1 Citation (Scopus)

High Power-Density 3D Integrated Power Supply Module Based on Panel-Level PCB Embedded Technology

Hou, F., Guo, X., Wang, Q., Wang, W., Lin, T., Cao, L., Zhang, G. Q. & Ferreira, J. A., 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC): Proceedings. O'Conner, L. (ed.). Piscataway, NJ: IEEE, p. 1365-1370 6 p. 8429721

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4 Citations (Scopus)

Interfacial Failure Characterization of Electronic Packaging Component Using a Multiscale Modelling Approach

Cui, Z., Zhang, Y., Yang, Q., Zhang, G. & Chen, X., 2018, Proceedings - 2018 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2018. Piscataway, NJ: IEEE, p. 68-70 3 p. 8421434

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Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages

Cui, Z., Chen, X., Fan, X. & Zhang, G., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-4 4 p.

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Internal stress state of TQFP subjected to liquid thermal shock using piezoresistive silicon stress sensor

Prisacaru, A., Sun, Y., Gromala, P. J., Han, B. & Zhang, G. Q., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-3 3 p.

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Lumen maintenance prediction for LEDs: New insights

Jacobs, B., van Driel, W. D. & Schuld, M., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-4 4 p.

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Modeling of Two-Dimensional Hyperbolic Heat Conduction in Silicon-On-Insulator Transistor by Equivalent RLC Network

Mirza Gheytaghi, A., Zhang, G. Q. & Ye, H., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-5 5 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Modulation of Gas Adsorption on SnS by strain

Hu, F., Ye, H., Tang, H. & Chen, X., 2 Oct 2018, Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018. Xiao, F., Wang, J., Chen, L. & Ye, T. (eds.). Piscataway, NJ: IEEE, p. 941-943 3 p. 8480834

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1 Citation (Scopus)

Non-linear bulk micromachined accelerometer for high sensitivity applications

Middelburg, L. M., Mansouri, B. E., Poelma, R., Zhang, G. Q., van Zeijl, H. & Wei, J., 2018, 2018 IEEE SENSORS Proceedings. Roy, A. & Gianchandani, Y. (eds.). Piscataway, NJ: IEEE, Vol. 2018-October. p. 1-4 4 p. 8589630

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SiC MOSFET Threshold-Voltage Instability under High Temperature Aging

Liu, Y., Chen, X., Zhao, Z., Li, Z., Lu, C., Zhang, J., Ye, H., Koh, S. W., Wang, L. & Zhang, G., 2018, Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018. Xiao, F., Wang, J., Chen, L. & Ye, T. (eds.). Piscataway, NJ: IEEE, p. 347-350 4 p. 8480781

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Study of ultraviolet assisted cure mechanism of the phosphor/silicone composites used in White LEDs

Wang, Z., Fan, J., Liu, J., Hu, A., Qian, C., Fan, X. & Zhang, G., 2018, Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018. Xioa, F., Wang, J., Chen, J. & Ye, T. (eds.). Piscataway, NJ: IEEE, p. 525-530 6 p. 8480566

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2 Citations (Scopus)

The performance of sintered nanocopper interconnections for high temperature device

Liu, Q., Chen, X., Zhu, J., Zhang, H., Zhang, J. S., Zhang, J. G., Wang, L., Ye, H., Koh, S. W. & Zhang, G. O., 2018, Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018. Xiao, F., Wang, J., Chen, L. & Ye, T. (eds.). Piscataway, NJ: IEEE, p. 1476-1478 3 p. 8480591

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2 Citations (Scopus)

Vacuum assisted liquified metal (VALM) TSV filling method with superconductive material

Alfaro, J. A., Sberna, P. M., Silvestri, C., Mastrangeli, M., Ishihara, R. & Sarro, P. M., 2018, 31st IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2018): Belfast, Northern Ireland. Piscataway, NJ: IEEE, Vol. 2018-January. p. 547-550 4 p.

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2 Citations (Scopus)
22 Downloads (Pure)

Wafer Level Through Polymer Optical Vias (TPOV) Enabling High Throughput of Optical Windows Manufacturing

Huang, Z. Q., Poelma, R. H., Vollebregt, S., Koelink, M. H., Boschman, E., Kropf, R., Gallouch, M. & Zhang, G. Q., 2018, 2018 7th Electronic System-Integration Technology Conference (ESTC). IEEE, p. 1-5 5 p.

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2017

An innovative approach to overcome saturation and recovery issues of CVD graphene-based gas sensors

Ricciardella, F., Vollebregt, S., Polichetti, T., Alfano, B., Massera, E. & Sarro, L., 2017, Proceedings of IEEE Sensors Conference 2017. Piscataway, NJ: IEEE, p. 1-3 3 p.

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3 Citations (Scopus)
14 Downloads (Pure)

A PoF and statistics combined reliability prediction for LED arrays in lamps

Sun, B., Fan, X., Fan, J., Zhang, G. Q. & Qian, C., 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. Piscataway, NJ: IEEE, p. 1-5 5 p. 7926264

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1 Citation (Scopus)
15 Downloads (Pure)

CMOS compatible embedded microchannels

Stoute, R., Muganda, J. M., Dahar, S., Arslan, A., Henderikx, R. J. M., van Stiphout, P. C. M., den Toonder, JMJ. & Dekker, R., 2017, 20th International Conference on Miniaturized Systems for Chemistry and Life Sciences (MicroTAS 2016). New York: Chemical and Biological Microsystems Society, Vol. 1. p. 164-167 4 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

Combining impedance spectroscopy with optical absorption spectroscopy in the UV for biofuel composition measurement

Middelburg, L., Ghaderi, M., Bossche, A., Bastemeijer, J., De Graaf, G., Wolffenbuttel, R., Soltis, R. & Visser, J., 2017, 2017 IEEE International Instrumentation and Measurement Technology Conference (I2MTC 2017) Proceedings. Piscataway, NJ: IEEE, p. 1-6 6 p. 7969676

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1 Citation (Scopus)
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Condition Monitoring Algorithm for Piezoresistive Silicon-Based Stress Sensor Data Obtained from Electronic Control Units

Prisacaru, A., Palczynska, A., Gromala, P. J., Han, B. & Zhang, G. Q., Jun 2017, Proceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017. Piscataway, NJ: IEEE, p. 1119-1127 9 p. 7999824

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4 Citations (Scopus)
19 Downloads (Pure)

Cryo-CMOS Circuits and Systems for Scalable Quantum Computing

Charbon, E., Sebastiano, F., Babaie, M., Vladimirescu, A., Shahmohammadi, M., Staszewski, R. B., Homulle, H. A. R., Patra, B., van Dijk, J. P. G., Incandela, R. M., Song, L. & Valizadehpasha, B., 2017, 2017 IEEE International Solid-State Circuits Conference, ISSCC 2017: Digest of Technical Papers. Fujino, L. C. (ed.). Danvers, MA: IEEE, Vol. 60. p. 264-265 2 p. 7870362

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21 Citations (Scopus)