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Research Output

  • 4 Conference contribution
  • 1 Article

Degradation Prediction of Electronic Packages using Machine Learning

Prisacaru, A., Guerrero, E. O., Gromala, P. J., Han, B. & Zhang, G. Q., 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. IEEE, p. 1-9 9 p. 8724523

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  • In Situ  Failure Detection of Electronic Control Units Using Piezoresistive Stress Sensor

    Prisacaru, A., Palczynska, A., Theissler, A., Gromala, P., Han, B. & Zhang, G. Q., 2018, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 8, 5, p. 750-763 14 p.

    Research output: Contribution to journalArticleScientificpeer-review

    Open Access
    File
  • 2 Citations (Scopus)
    11 Downloads (Pure)

    Internal stress state of TQFP subjected to liquid thermal shock using piezoresistive silicon stress sensor

    Prisacaru, A., Sun, Y., Gromala, P. J., Han, B. & Zhang, G. Q., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-3 3 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  • Condition Monitoring Algorithm for Piezoresistive Silicon-Based Stress Sensor Data Obtained from Electronic Control Units

    Prisacaru, A., Palczynska, A., Gromala, P. J., Han, B. & Zhang, G. Q., Jun 2017, Proceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017. Piscataway, NJ: IEEE, p. 1119-1127 9 p. 7999824

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

    Open Access
    File
  • 4 Citations (Scopus)
    18 Downloads (Pure)

    Prognostics and health monitoring of electronic system: A review

    Prisacaru, A., Gromala, P. J., Jeromio, M. B., Han, B. & Qi Zhang, G., 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. Piscataway, NJ: IEEE, p. 1-11 11 p. 7926248

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

    Open Access
    File
  • 5 Citations (Scopus)
    24 Downloads (Pure)