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Research Output

  • 4 Article
  • 2 Conference contribution
  • 1 Review article
  • 1 Dissertation (TU Delft)

Fan-Out Panel-Level PCB-Embedded SiC Power MOSFETs Packaging

Hou, F., Wang, Q., Chen, M., Zhang, G., Ferreira, B., Wang, W., Ma, R., Su, M., Song, Y. & More Authors, 1 Mar 2020, In : IEEE Journal of Emerging and Selected Topics in Power Electronics. 8, 1, p. 367-380 14 p., 8894039.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
File
  • 47 Downloads (Pure)

    Fan-Out SiC MOSFET Power Module in an Organic Substrate

    Hou, F., 2020, 132 p.

    Research output: ThesisDissertation (TU Delft)

    Microchannel Thermal Management System with Two-Phase Flow for Power Electronics over 500 W/cm2Heat Dissipation

    Hou, F., Zhang, H., Huang, D., Fan, J., Liu, F., Lin, T., Cao, L., Fan, X., Ferreira, B. & Zhang, G., 2020, In : IEEE Transactions on Power Electronics. 35, 10, p. 10592-10600 9 p., 9057466.

    Research output: Contribution to journalArticleScientificpeer-review

    Open Access
    File
  • 1 Downloads (Pure)

    Review of Packaging Schemes for Power Module

    Hou, F., Wang, W., Cao, L., Li, J., Su, M., Lin, T., Zhang, G. & Ferreira, B., 1 Mar 2020, In : IEEE Journal of Emerging and Selected Topics in Power Electronics. 8, 1, p. 223-238 16 p., 8869891.

    Research output: Contribution to journalReview articleScientificpeer-review

    Open Access
    File
  • 108 Downloads (Pure)

    Characterization of PCB Embedded Package Materials for SiC MOSFETs

    Hou, F., Wang, W., Lin, T., Cao, L., Zhang, G. Q. & Ferreira, J. A., 2019, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 9, 6, p. 1054-1061 8 p., 8666143.

    Research output: Contribution to journalArticleScientificpeer-review

    Open Access
    File
  • 3 Citations (Scopus)
    205 Downloads (Pure)