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Research Output

3D interconnect technology based on low temperature copper nanoparticle sintering

Zhang, B., Carisey, Y., Damian, A., Poelma, R., Zhang, G. Q. & van Zeijl, H., 2016, Proceedings of the 17th International Conference on Electronic Packaging Technology (ICEPT). Bi, K., Liu, S. & Zhou, S. (eds.). IEEE, p. 1163-1167

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
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3 Citations (Scopus)
52 Downloads (Pure)

3D system-in-package design using stacked silicon submount technology

Dong, M., Santagata, F., Sokolovskij, R., Wei, J., Yuan, C. & Zhang, GQ., 2015, In : Microelectronics International: an international journal. 32, 2, p. 63-72 10 p.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
6 Citations (Scopus)

Ab Initio study of temperature, humidity, and covalent functionalization-induced bandgap change of single-walled carbon nanotubes

Chen, XP., Yang, N., Jiang, JK., Liang, QH., Yang, DG., Zhang, GQ. & Ren, TL., 2015, In : IEEE Electron Device Letters. 36, 6, p. 606-608 3 p.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
20 Citations (Scopus)

Accelerated lifetime test for isolated components in linear drivers of high-voltage LED system

Sun, B., Koh, SW., Yuan, CA., Fan, X. & Zhang, GQ., 2013, Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013). Zhang, GQ. (ed.). Piscataway: IEEE Society, p. 1-5 5 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
11 Citations (Scopus)

Accelerated life time testing and optical degradation of remote phosphor plates

Yazdan Mehr, M., van Driel, WD. & Zhang, GQ., 2014, In : Microelectronics Reliability. 54, 8, p. 1544-1548 5 p.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
28 Citations (Scopus)

Accelerated reliability test method for optics in LED luminaire applications

Yazdan Mehr, M., van Driel, WD. & Zhang, GQ., 2015, Proceedings of the 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. s.n. (ed.). Piscataway: IEEE Society, p. 1-4 4 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
1 Citation (Scopus)

Accelerated testing method of LED luminaries

Cai, M., Yang, DG., Koh, SW., Yuan, CA., Chen, WB., Wu, B. -Y. & Zhang, GQ., 2012, Proceedings 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. De Saint Leger et al, O. (ed.). Piscataway, NJ, USA: IEEE Society, p. 505-510 6 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
17 Citations (Scopus)

Accuracy of CMOS-Based Piezoresistive Stress Sensor for Engineering Applications of Thermal Loading Condition: Theoretical Review and Experimental Validation

Prisacaru, A., Palczynska, A., Gromala, P., Wu, B., Han, B. & Zhang, G., 15 Oct 2019, In : IEEE Sensors Journal. 19, 20, p. 9139-9148 10 p., 8732451.

Research output: Contribution to journalArticleScientificpeer-review

1 Citation (Scopus)

A CMOS-Compatible Hybrid Plasmonic Slot Waveguide With Enhanced Field Confinement

Xiao, J., Wei, Q-Q., Yang, D., Zhang, P., He, N., Zhang, G. Q., Ren, T-L. & Chen, X-P., 2016, In : IEEE Electron Device Letters. 37, 4, p. 456-458 3 p.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
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13 Citations (Scopus)
27 Downloads (Pure)

A design and qualification of LED flip Chip-on-Board module with tunable color temperatures

Fan, J., Cao, J., Yu, C., Qian, C., Fan, X. & Zhang, G., 2018, In : Microelectronics Reliability. 84, p. 140-148 9 p.

Research output: Contribution to journalArticleScientificpeer-review

3 Citations (Scopus)

A DFT study of In doped Tl2O: a superior NO2 gas sensor with selective adsorption and distinct optical response

Gao, C., Zhang, Y., Yang, H., Liu, Y., Liu, Y., Du, J., Ye, H. & Zhang, G., 15 Nov 2019, In : Applied Surface Science. 494, p. 162-169 8 p.

Research output: Contribution to journalArticleScientificpeer-review

5 Citations (Scopus)

Advanced LED package with temperature sensors and microfluidic cooling

Ye, H., van Zeijl, HW., Sokolovskij, R., Gielen, AWJ. & Zhang, GQ., 2013, Proceedings 63rd Electronic Components and Technology Conference (ECTC 2013). Sauter, W. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1920-1925 6 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
3 Citations (Scopus)

Advanced numerical prototyping methods in modern engineering applications - Optimisation for micro-electronic package reliability

Wymyslowski, A., van Driel, WD., van de Peer, J., Tzannetakis, N. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 280-289 10 p.

Research output: Contribution to journalArticleScientificpeer-review

5 Citations (Scopus)

Advanced structural similarity rules for the BGA package family

van Driel, WD., Mavinkurve, A., van Gils, MAJ. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 205-214 10 p.

Research output: Contribution to journalArticleScientificpeer-review

10 Citations (Scopus)

Advances in delamination modeling

van der Sluis, O., Yuan, CA., van Driel, WD. & Zhang, GQ., 2008, Nanopackaging: Nanotechnologies and Electronics Packaging. Morris, JE. (ed.). Springer, p. 1-34 549 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientificpeer-review

Advances in delamination modeling of metal/polymer systems: Atomistic aspects

Van Der Sluis, O., Iwamoto, N., Qu, J., Yang, S., Yuan, C., Van Driel, W. D. & Zhang, G. Q., 1 Jan 2018, Nanopackaging: Nanotechnologies and Electronics Packaging, Second Edition. Springer, p. 129-183 55 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientificpeer-review

A first-principles study: Adsorption of small gas molecules on GeP3 monolayer

Niu, F., Cai, M., Pang, J., Li, X., Zhang, G. & Yang, D., 2019, In : Surface Science. 684, p. 37-43 7 p.

Research output: Contribution to journalArticleScientificpeer-review

4 Citations (Scopus)

Aging Effects on IMC Formation and Joint Strength of Low-Ag SAC Solder/UBM (Ni (P)-Au) for WLCSP

Sun, F., Hochstenbach, HP., van Driel, WD. & Zhang, GQ., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 308-311 4 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

A high responsivity and controllable recovery ultraviolet detector based on a WO3gate AlGaN/GaN heterostructure with an integrated micro-heater

Sun, J., Zhang, S., Zhan, T., Liu, Z., Wang, J., Yi, X., Li, J., Sarro, P. M. & Zhang, G., 2020, In : Journal of Materials Chemistry C. 8, 16, p. 5409-5416 8 p.

Research output: Contribution to journalArticleScientificpeer-review

AlGaN/GaN HEMT micro-sensor technology for gas sensing applications

Sokolovskij, R., Zhang, J., Jiang, Y., Chen, G., Zhang, G. Q. & Yu, H., 2018, ICSICT-2018 - 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) Proceedings. Jiang, Y-L., Tang, T-A. & Ye, F. (eds.). Piscataway, NJ: IEEE, p. 1-4 4 p. 8564904

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
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25 Downloads (Pure)

A lifetime prediction method for Solid State Lighting power converters based on SPICE models and finite element thermal simulations

Sun, B., Fan, X., Zhao, L., Yuan, CA., Koh, SW. & Zhang, GQ., 2014, Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. s.n. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1-4 4 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
1 Citation (Scopus)

A Low-Power MEMS IDE Capacitor with Integrated Microhotplate: Application as Methanol Sensor using a Metal-Organic Framework Coating as Affinity Layer

Venkatesh, M. R., Sachdeva, S., El Mansouri, B., Wei, J., Bossche, A., Bosma, D., de Smet, L. C. P. M., Sudhölter, E. J. R. & Zhang, G. Q., 2019, In : Sensors (Basel, Switzerland). 19, 4, p. 1-19 19 p., 888.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
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111 Downloads (Pure)

A Micromechanics-Based Vapor Pressure Model in Electronic Packages

Fan, XJ., Zhou, J., Zhang, GQ. & Ernst, LJ., 2005, In : Journal of Electronic Packaging. 127, p. 262-267 6 p.

Research output: Contribution to journalArticleScientificpeer-review

50 Citations (Scopus)

A model in predicting color of LED packages with different phosphor layer dimensions

Wong, CKY., Leung, SYY., Xiong, YJ., Yuan, CCA. & Zhang, GQ., 2014, Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. Piscataway, NJ, USA: IEEE Society, p. 1-5 5 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
4 Citations (Scopus)

A multi-step etch method for fabricating slightly tapered through-silicon vias based on modified Bosch process

Lin, P., Xie, X., Wang, Y., Lian, B. & Zhang, G., 2019, In : Microsystem Technologies. 25, 7, p. 2693-2698 6 p.

Research output: Contribution to journalArticleScientificpeer-review

An accelerated test method of luminous flux depreciation for LED luminaires and lamps

Qian, C., Fan, X., Fan, JJ., Yuan, C. A. & Zhang, G. Q., 2016, In : Reliability Engineering & System Safety. 147, March, p. 84-92 9 p.

Research output: Contribution to journalArticleScientificpeer-review

40 Citations (Scopus)

An Alternative Solder Interconnect Reliability Test to Evaluate Drop Impact Performance

Zaal, JJM., Hochstenbach, HP., van Driel, WD. & Zhang, GQ., 2008, 2008 Proceedings 58th Electronic Components & Technology Conference. Wipiejewski, T. & Trewhella, J. (eds.). Orlando, FL, USA: IEEE Society, p. 1181-1186 6 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

5 Citations (Scopus)

Analysis of Cu/low-k bond pad delamination by using a novel failure index

van Gils, MAJ., van der Sluis, O., Zhang, GQ., Jansen, JHJ. & Voncken, RMJ., 2005, Proceedings of the 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Ernst, LJ., Zhang, GQ., Rodgers, P., Marco, S. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 190-196 7 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

11 Citations (Scopus)

Analytical Method for Determination of Young's Modulus of Large Deflection Carbon Nanotube

Tolou, N., Khiat, A., Zhang, G. Q. & Herder, JL., 2011, In : International Journal of Nonlinear Sciences and Numerical Simulation. 12, p. 1-8 8 p.

Research output: Contribution to journalArticleScientificpeer-review

6 Citations (Scopus)

An approach to "design for reliability" in solid state lighting systems at high temperatures

Tarashioon, S., Baiano, A., van Zeijl, H., Guo, C., Koh, SW., van Driel, WD. & Zhang, GQ., 2012, In : Microelectronics Reliability. 52, 5, p. 783-793 11 p.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
29 Citations (Scopus)

An automated hybrid bioelectronic system for autogenous restoration of sinus rhythm in atrial fibrillation

Nyns, E. C. A., Poelma, R. H., Volkers, L., Plomp, J. J., Bart, C. I., Kip, A. M., van Brakel, T. J., Zeppenfeld, K., Schalij, M. J., Zhang, G. Q., de Vries, A. A. F. & Pijnappels, D. A., 2019, In : Science Translational Medicine. 11, 481, p. 1-11 11 p., eaau6447.

Research output: Contribution to journalArticleScientificpeer-review

9 Citations (Scopus)
13 Downloads (Pure)

An effective optics-electrochemistry approach to random packing density of non-equiaxed ellipsoids

Dai, H., Xu, W., Hu, Z., Yang, B., Xiong, Z., Su, D., Wei, X., Mei, S., Zhang, G. & More Authors, 1 Aug 2020, In : Materialia. 12, 5 p., 100750.

Research output: Contribution to journalArticleScientificpeer-review

A new hermetic sealing method for ceramic package using nanosilver sintering technology

Zhang, H., Liu, Y., Wang, L., Fan, J., Fan, X., Sun, F. & Zhang, G. Q., 2018, In : Microelectronics Reliability. 81, p. 143-149 7 p.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
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6 Citations (Scopus)
20 Downloads (Pure)

A new self-sealing thin-film encapsulation process for MEMS

Santagata, F., Zaccaria, I., Poelma, RH., Creemer, JF., Zhang, GQ. & Sarro, PM., 2013, Proceedings 17th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXVII. Morante, JR. & Hierold, C. (eds.). Piscataway, NJ, USA: IEEE Society, p. 822-825 4 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access

An Experimental-Numerical Study of Metal Peel Off in Cu/low-k Back-End Structures

Kregting, R., van Silfhout, RBR., van der Sluis, O., Engelen, RAB., van Driel, WD. & Zhang, GQ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronic Engineers, Inc., p. 210-215 6 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

A novel design of heatsink-less LED base fluorescent lamp retrofit

Zhao, J., Liu, Y., Tang, H., Leung, SYY., Yuan, CCA. & Zhang, GQ., 2014, Proceedings of the 15th International Conference on Electronic Packaging Technology. Bi, K., Tian, Z. & Xu, Z. (eds.). Piscatawa, NJ, USA: IEEE Society, p. 1202-1207 6 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
1 Citation (Scopus)

A novel hybrid method for reliability prediction of high-power LED luminaires

Cai, M., Tian, KM., Chen, WB., Huang, H., Tang, HY., Liang, LL., Yang, DG., Fan, X. & Zhang, GQ., 2013, Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013). Zhang, GQ. (ed.). Piscataway: IEEE Society, p. 1-5 5 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
7 Citations (Scopus)

A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation

Sun, B., Fan, X., Ye, H., Fan, J., Qian, C., van Driel, W. & Zhang, G. Q., 1 Jul 2017, In : Reliability Engineering & System Safety. 163, p. 14-21 8 p.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
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18 Citations (Scopus)
21 Downloads (Pure)

A Novel Partial Carrier Stored and Hole Path IGBT for Ultralow Turn-Off Loss and On-State Voltage With High EMI Noise Controllability

Wang, S., Tan, C., Wang, L., Luo, H., Zhang, G. & Chen, X., 1 Mar 2019, 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019. IEEE, p. 410-412 3 p. 8731110

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

An overview of scanning acoustic microscope, a reliable method for non-destructive failure analysis of microelectronic components

Mehr, M. Y., Bahrami, A., Fischer, H., Gielen, S., Corbeij, R., Van Driel, W. D. & Zhang, G. Q., 1 Jan 2015, 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. Institute of Electrical and Electronics Engineers (IEEE), 7103077

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

9 Citations (Scopus)

An overview of scanning acoustic microscope, a reliable method for non-destructive failure analysis of microelectronic components

Yazdan Mehr, M., Bahrami, A., Fischer, H., Gielen, S., Corbeij, R., van Driel, WD. & Zhang, GQ., 2015, Proceedings of the 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. s.n. (ed.). Piscataway: IEEE Society, p. 1-4 4 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access

A numerical experimental approach for characterizing the elastic properties of thin films: application of nanocantilevers

Poelma, RH., Sadeghian Marnani, H., Noijen, SPM., Zaal, JJM. & Zhang, GQ., 2011, In : Journal of Micromechanics and Microengineering. 21, 6, p. 1-11 11 p.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
19 Citations (Scopus)

A photovoltaic window with sun-tracking shading elements towards maximum power generation and non-glare daylighting

Gao, Y., Dong, J., Isabella, O., Santbergen, R., Tan, H., Zeman, M. & Zhang, G. Q., 2018, In : Applied Energy. 228, p. 1454-1472 19 p.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
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13 Citations (Scopus)
6 Downloads (Pure)

A PoF and statistics combined reliability prediction for LED arrays in lamps

Sun, B., Fan, X., Fan, J., Zhang, G. Q. & Qian, C., 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. Piscataway, NJ: IEEE, p. 1-5 5 p. 7926264

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
File
1 Citation (Scopus)
15 Downloads (Pure)

A polymer based miniature loop heat pipe with silicon substrate and temperature sensors for high brightness light-emitting diodes

Ye, H., Sokolovskij, R., van Zeijl, HW., Gielen, AWJ. & Zhang, GQ., 2014, In : Microelectronics Reliability. 54, 6-7, p. 1355-1362 8 p.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
8 Citations (Scopus)

A probabilistic physics-of-failure reliability assessment approach for integrated LED lamps

Sun, B., Fan, J., Fan, X. & Zhang, G., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-5 5 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
File
1 Citation (Scopus)
12 Downloads (Pure)

A Reliability Prediction for Integrated LED Lamp with Electrolytic Capacitor-Free Driver

Sun, B., Fan, X., Li, L., Ye, H., van Driel, W. & Zhang, G. Q., 2017, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 7, 7, p. 1081-1088 8 p., 7935411.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
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6 Citations (Scopus)
13 Downloads (Pure)

A Reliability Prediction Methodology for LED Arrays

Sun, B., Fan, J., Fan, X., Zhang, G. & Zhang, G., 2019, In : IEEE Access. 7, p. 8127-8134 8 p., 8600302.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
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1 Citation (Scopus)
119 Downloads (Pure)

A review of small heat pipes for electronics

Chen, X., Ye, H., Fan, X., Ren, T. & Zhang, G. Q., 2016, In : Applied Thermal Engineering. 96, p. 1-17 17 p.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
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96 Citations (Scopus)
373 Downloads (Pure)

A review on discoloration and high accelerated testing of optical materials in LED based-products

Yazdan Mehr, M., Toroghinejad, M. R., Karimzadeh, F., van Driel, W. D. & Zhang, G. Q., 2018, In : Microelectronics Reliability. 81, p. 136-142 7 p.

Research output: Contribution to journalArticleScientificpeer-review

8 Citations (Scopus)