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Research Output

2007

Mechanical Characterization of III-V Nanowire Using Molecular Dynamics Simulation

Dawotola, AW., Yuan, CA., van Driel, WD., Bakkers, EPAM. & Zhang, GQ., 2007, EuroSimE 2007. Ernst, LJ. (ed.). London: EuroSimE, p. 1-5 5 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Mechanical reliability challenges for MEMS packages: Capping

van Driel, WD., Yang, D., Yuan, CA., van Kleef, M. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 1823-1826 4 p.

Research output: Contribution to journalArticleScientificpeer-review

12 Citations (Scopus)

Mechanical reliability of a segmented silicon layer on ultra-thin polyimide substrates

WANG, L., Xiao, A., Jansen, KMB., Bartek, M., Zoumpoulidis, T., Ernst, LJ. & Zhang, GQ., 2007, In : Key Engineering Materials. 353-358, p. 2529-2532 4 p.

Research output: Contribution to journalArticleScientificpeer-review

Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques

Gonda, V., Jansen, KMB., Ernst, LJ., den Toonder, J. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 248-251 4 p.

Research output: Contribution to journalArticleScientificpeer-review

9 Citations (Scopus)

Modeling of the mechanical stiffness of the GaP/GaAs nanowires with point defects/stacking faults

Dawotola, AW., Yuan, CA., van Driel, WD., Zhang, GQ. & Bakkers, EPAM., 2007, Proceedings 7th International Conference on Electronics Packaging Technology (ICEPT 2007). Liu, S. & Keyun Bi (eds.). Shanghai, China: IEEE Society, p. 1-5 5 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Molecular simulation on the material/interfacial strength of the low-dielectric materials

Yuan, CA., van der Sluis, O., Zhang, GQ., Ernst, LJ., van Driel, WD. & van Silfhout, RBR., 2007, In : Microelectronics Reliability. 47, p. 1483-1491 9 p.

Research output: Contribution to journalArticleScientificpeer-review

19 Citations (Scopus)

Novel shear tools for viscoelastic characterization of packaging polymers

van t Hof, C., Jansen, KMB., Wisse, G., Ernst, LJ., Yang, DG., Zhang, GQ. & Bressers, HJL., 2007, In : Microelectronics Reliability. 47, p. 240-247 8 p.

Research output: Contribution to journalArticleScientificpeer-review

7 Citations (Scopus)

Numerical modeling of warpage induced in QFN array molding process

Yang, D., Jansen, KMB., Ernst, LJ., Zhang, GQ., van Driel, WD., Bressers, HJL. & Janssen, JHJ., 2007, In : Microelectronics Reliability. 47, p. 310-318 9 p.

Research output: Contribution to journalArticleScientificpeer-review

35 Citations (Scopus)

Numerical simulation on the mechanical characteristics of double-stranded DNA under axial stretching and lateral unzipping

Yuan, CA., Zhang, GQ., Han, CN., Chiang, KN. & Cui, Y., 2007, In : Journal of Applied Physics. 101, 074702, p. 1-8 8 p.

Research output: Contribution to journalArticleScientificpeer-review

Pattern Shifting Analyses of Micro-structures of IC Package

He, Y., Shi, R., Li, HP., Li, F., Zhang, GQ. & Ernst, LJ., 2007, In : Key Engineering Materials. 340-341, p. 1333-1338 6 p.

Research output: Contribution to journalArticleScientificpeer-review

1 Citation (Scopus)

Polymer Materials Characterization, Modeling and Application

Ernst, LJ., Jansen, KMB., Yang, D., van t Hof, C., Bressers, HJL., Janssen, JHJ. & Zhang, GQ., 2007, Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging. Suhir, E., Lee, YC. & Wong, CP. (eds.). New York, NY, USA: Springer, p. 1-63 701 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientificpeer-review

Testing solder interconnect reliabilty under drop impact loading conditions

Zaal, JJM., van Driel, WD., Hochstenbach, HP. & Zhang, GQ., 2007, 8th ICEPT (International Conference on Electronics Packaging Technology). s.n. (ed.). s.l.: s.n., p. 1-6 6 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

The chemical-mechanical relationship of the SiOC(H) dielectric film

Yuan, CA., van der Sluis, O., Zhang, GQ., Ernst, LJ., van Driel, WD., van Silfhout, RBR. & Thijsse, BJ., 2007, EuroSimE 2007. Ernst, LJ. (ed.). London: EuroSimE, p. 1-6 6 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

The prediction of the mechanical stiffness of the silicon based crystalline/amorphous nano-structures using molecular dynamic (MD) simulation

Yuan, CA., van der Sluis, O., Zhang, GQ., Ernst, LJ., van Driel, WD. & van Silfhout, RBR., 2007, NanoTech 2007. Laudon, M. (ed.). Santa Clara, CA, USA: NanoTech, p. 1-4 4 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Virtual Thermo-Mechanical Prototyping of Microelectronics and Microsystems

Wymyslowski, A., Zhang, GQ., van Driel, WD. & Ernst, LJ., 2007, Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging. Suhir, E., Lee, YC. & Wong, CP. (eds.). New York, NY, USA: Springer, p. 205-266 701 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientificpeer-review

2006

An Experimental-Numerical Study of Metal Peel Off in Cu/low-k Back-End Structures

Kregting, R., van Silfhout, RBR., van der Sluis, O., Engelen, RAB., van Driel, WD. & Zhang, GQ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronic Engineers, Inc., p. 210-215 6 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Delamination Analysis of Cu/low-k Technology Subjected to Chemical-Mechanical Polishing Process Conditions

Yuan, CA., van Driel, WD., van Silfhout, RBR., van der Sluis, O., Engelen, RAB., Ernst, LJ., van Keulen, F. & Zhang, GQ., 2006, In : Microelectronics Reliability. 46, p. 1679-1684 6 p.

Research output: Contribution to journalArticleScientific

8 Citations (Scopus)

Design, Experiment and Analysis of the Solder on Rubber (SOR) structure of WLCSP

Yuan, CA., Zhang, GQ., Huang, CS., Yu, CH., Yang, CC., Yang, WK., Yew, MC., Nan Han, C. & Chiang, KN., 2006, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds.). Como, Italy: EuroSimE, p. 1-7 7 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Design and Analysis of a novel fan-out WLCSP structure

Yuan, CA., Zhang, GQ., Huang, CS., Yu, CH., Yang, CC., Yang, WK., Yew, MC., Chou, CY. & Chiang, KN., 2006, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds.). Como, Italy: EuroSimE, p. 1-4 4 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

5 Citations (Scopus)

Design for Reliability of Wafer Level Packages

van Driel, WD., Hochstenbach, HP. & Zhang, GQ., 2006, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Micro-Systems, EuroSimE 2006. Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds.). Como, Italy: EuroSimE, p. 1-5 5 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

7 Citations (Scopus)

Designing for 1st and 2nd Level Reliability of Micro-Electronic Packages using Combined Experimental - Numerical Techniques

van Silfhout, RBR., Jansen, MY., van Driel, WD. & Zhang, GQ., 2006, Proceedings 56th Electronic Components & Technology Conference 2006. sn (ed.). San Diego, CA, USA: IEEE Society, p. 1-7 7 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Effects of aeronautical conditions on passivation cracking of micro-structures of IC packages

He, YT., Li, HP., Li, F., WANG, L., Zhang, GQ. & Ernst, LJ., 2006, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Micro-Systems, EuroSimE 2006. Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds.). Como, Italy: EuroSimE, p. 1-4 4 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Filler Contents Effects on the Moisture Absorption and Viscoelasticity of Thermosetting IC Packaging Polymers

Ma, X., Jansen, KMB., Zhang, GQ. & Ernst, LJ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai. China: Institute of Electrical and Electronics Engineers (IEEE), p. 161-165 5 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

Fully Cure-Dependent Modeling and Characterization of EMC's with Application to Package Warpage Simulation

Ernst, LJ., Jansen, KMB., Saraswat, MK., van t Hof, C., Zhang, GQ., Yang, DG. & Bressers, HJL., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronics Engineers (IEEE), p. 123-129 7 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

Fully Cure-Dependent Modelling and Characterization of EMC's with Application to Package Warpage Simulation

Ernst, LJ., Jansen, KMB., Saraswat, MK., Zhang, GQ., Yang, D., van t Hof, C. & Bressers, HJL., 2006, Proceedings 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces. sn (ed.). Atlanta, GA, USA: IEEE Society, p. 23-27 5 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Hygroscopic Effects on Swelling and Viscoelasticity of Electronic Packaging Epoxy

Ma, X., Jansen, KMB., Zhang, GQ. & Ernst, LJ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronics Engineers (IEEE), p. 262-266 5 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

11 Citations (Scopus)

Mechanics of Microelectronics

Zhang, GQ., van Driel, WD. & Fan, XJ., 2006, Dordrecht: Springer. 563 p.

Research output: Book/ReportBookScientific

Multiscale modelling of multilayer substrates

Ubachs, RLJM., van der Sluis, O., van Driel, WD. & Zhang, GQ., 2006, In : Microelectronics Reliability. 46, p. 1472-1477 6 p.

Research output: Contribution to journalArticleScientific

6 Citations (Scopus)

Passivation Cracking Analyses of ICs for Different Fixing Position under the Aeronautical Working Conditions

He, YT., Li, HP., Li, F., Shi, R., Zhang, GQ. & Ernst, LJ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronics Engineers (IEEE), p. 755-759 5 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

Passivation Cracking Analyses of Micro-structures of IC Packages

He, Y., Li, H., Shi, R., Li, F., Zhang, GQ. & Ernst, LJ., 2006, In : Key Engineering Materials. 324-325, p. 515-518 4 p.

Research output: Contribution to journalArticleScientificpeer-review

Reliability challenges in the nanoelectronics era

van Roosmalen, AJ. & Zhang, GQ., 2006, In : Microelectronics Reliability. 46, p. 1403-1414 12 p.

Research output: Contribution to journalArticleScientific

16 Citations (Scopus)

Reliability Modelling for Packages in Flexible End-Products

van Driel, WD., van der Sluis, O., Yang, DG., Ubachs, RLJM., Zenz, C., Aflenzer, G. & Zhang, GQ., 2006, In : Microelectronics Reliability. 46, p. 1880-1885 6 p.

Research output: Contribution to journalArticleScientific

6 Citations (Scopus)

Strategic Research Agenda of "More than Moore"

Zhang, GQ., Graef, M. & van Roosmalen, F., 2006, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds.). Como, Italy: EuroSimE, p. 1-6 6 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

6 Citations (Scopus)

The Effects of Packaging on RFICs

Mandal, G., Mishra, G., van Driel, WD. & Zhang, GQ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronics Engineers (IEEE), p. 166-172 7 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

The Rationale and Paradigm of "More than Moore"

Zhang, GQ., Graef, M. & van Roosmalen, F., 2006, Proceedings 56th Electronic Components & Technology Conference 2006. sn (ed.). San Diego, CA, USA: IEEE Society, p. 151-157 7 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

19 Citations (Scopus)

Thin Film Interfacial Strength Characterization using Mixed Mode Bending

Xiao, A., Wang, LG., van Driel, WD., Yang, DG., Yuan, CA. & Zhang, GQ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronics Engineers (IEEE), p. 785-789 5 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Virtual Design and Qualification of IC Backend Structures

van Silfhout, RBR., van der Sluis, O., van Driel, WD., Janssen, JHJ. & Zhang, GQ., 2006, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds.). Como, Italy: EuroSimE, p. 1-5 5 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

1 Citation (Scopus)
2005

A Micromechanics-Based Vapor Pressure Model in Electronic Packages

Fan, XJ., Zhou, J., Zhang, GQ. & Ernst, LJ., 2005, In : Journal of Electronic Packaging. 127, p. 262-267 6 p.

Research output: Contribution to journalArticleScientificpeer-review

50 Citations (Scopus)

Analysis of Cu/low-k bond pad delamination by using a novel failure index

van Gils, MAJ., van der Sluis, O., Zhang, GQ., Jansen, JHJ. & Voncken, RMJ., 2005, Proceedings of the 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Ernst, LJ., Zhang, GQ., Rodgers, P., Marco, S. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 190-196 7 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

11 Citations (Scopus)

Driving mechanisms of delamination related reliability problems in exposed pad packages

van Driel, WD., Bressers, HJL., Janssen, JHJ., Bielen, JA., Yan, X., van Gils, MAJ., Stevens, PMP., Habets, PJJHA., Zhang, GQ. & Ernst, LJ., 2005, Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings of EuroSIME 2005. Ernst, LJ, Zhang, GQ, Rodgers, P, Meuwissen, M, Marco, S & Saint Leger, O de (eds.). IEEE Society, p. 183-189 7 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

14 Citations (Scopus)

Experimental and numerical investigation on warpage of QFN packages induced during the array molding process

Yang, D., Jansen, KMB., Ernst, LJ., Zhang, GQ., Beijer, JGJ. & Janssen, JHJ., 2005, Polytronic 2005 - Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Dziedzic, A. & Felba, J. (eds.). Piscataway: IEEE Society, p. 1-5 5 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

7 Citations (Scopus)

Fast characterization for moisture properties of moulding compounds: Influence of temperature and humidity

Vogels, RCJ., Huang, M., Yang, D., van Driel, WD. & Zhang, GQ., 2005, Proceedings of 2005 6th International Conference on Electronic Packaging Technology. Keyun, Bi, Chunqing & Wang (eds.). Piscataway, New Jersey: IEEE Society, p. 185-190 6 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

6 Citations (Scopus)

Geometry Sensitivity Analyses of Microstructures of IC Packages on Passivation Cracking

He, Y., Li, F., Shi, R., Zhang, GQ., Ernst, LJ., Zhang, J. & Song, ZT., 2005, In : Key Engineering Materials. 297-300, p. 819-824 6 p.

Research output: Contribution to journalArticleScientificpeer-review

80 Citations (Scopus)

Multi-physics based structural similarity rules for the BGA package family

van Driel, WD., Mavinkurve, A., van Gils, MAJ., Zhang, GQ., Yang, D. & Ernst, LJ., 2005, Proceedings of the 55th Electronic Components and Technology Conference. s.n. (ed.). Piscataway, NJ: IEEE Society, p. 165-171 7 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

2 Citations (Scopus)

Novel approach to numerical prototyping in microelectronics and microsystems

Wymyslowski, A., Zhang, GQ., Van de Peer, J., Tzannetakis, N. & van Driel, WD., 2005, Proceedings of the 55th Electronic Components and Technology Conference. s.n. (ed.). Piscataway, NJ: IEEE Society, p. 1822-1828 7 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Novel damage model for delamination in Cu/low-k IC backend structures

van Gils, MAJ., van der Sluis, O., Zhang, GQ., Janssen, JHJ. & Voncken, RMJ., 2005, Proceedings of the 55th Electronic Components and Technology Conference. s.n. (ed.). Piscataway, NJ: IEEE Society, p. 988-994 7 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

3 Citations (Scopus)

Prediction of delamination related ic & packaging reliability problems

van Driel, WD., van Gils, MAJ., van Silfhout, RBR. & Zhang, GQ., 2005, In : Microelectronics Reliability. 45, 9-11, p. 1633-1638 6 p.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
32 Citations (Scopus)

Process-induced warpage in HVQFN package: effect of design parameters and processing conditions

Yang, D., Ernst, LJ., Jansen, KMB., Zhang, GQ., Janssen, JHJ. & Bressers, HJL., 2005, Polytronic 2005 - Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Dziedzic, A. & Felba, J. (eds.). Piscataway: IEEE Society, p. 25-29 5 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

3 Citations (Scopus)

Smart and sequential approach to numerical prototyping in micro-electronic applications

Wymyslowski, A., van Driel, WD., Zhang, GQ., van de Peer, J. & Tzannetakis, N., 2005, In : Journal of Microelectronics and Electronic Packaging. 2, 1, p. 1-7 7 p.

Research output: Contribution to journalArticleScientificpeer-review

6 Citations (Scopus)

State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films

Jansen, KMB., Gonda, V., Ernst, LJ., Bressers, HJL. & Zhang, GQ., 2005, In : Journal of Electronic Packaging. 127, p. 530-536 7 p.

Research output: Contribution to journalArticleScientificpeer-review

7 Citations (Scopus)