Research output per year
Research output per year
Personal profile
Research profile
Hanzhi Xun received the B.Sc. and M.Eng. degrees from Xidian University, Xi'an, China, in 2018 and 2021, respectively. He also received M.Eng. degree form Waseda University, Kitakyushu, Japan, in 2021. He is currently working toward the Ph.D. degree at the Computer Engineering Laboratory, Delft University of Technology, Delft, The Netherlands. His research interests focus on device modeling, testing, and reliability of Resistive RAMs.
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Research output
- 5 Conference contribution
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Characterization and Test of Intermittent Over RESET in RRAMs
Xun, H., Fieback, M., Yuan, S., Aziza, H., Heidekamp, M., Copetti, T., Poehls, L. B., Taouil, M. & Hamdioui, S., 2023, Proceeding of the 2023 IEEE 32nd Asian Test Symposium (ATS). Piscataway: IEEE, 6 p. (Asian Test Symposium Proceedings).Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review
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Data Background-Based Test Development for All Interconnect and Contact Defects in RRAMs
Xun, H., Fieback, M., Yuan, S., Zhang, Z., Taouil, M. & Hamdioui, S., 2023, Proceedings of the 2023 IEEE European Test Symposium (ETS). IEEE, 6 p. (Proceedings of the European Test Workshop; vol. 2023-May).Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review
Open AccessFile1 Citation (Scopus)9 Downloads (Pure) -
Device-Aware Test for Back-Hopping Defects in STT-MRAMs
Yuan, S., Taouil, M., Fieback, M., Xun, H., Marinissen, E. J., Kar, G. S., Rao, S., Couet, S. & Hamdioui, S., 2023, 2023 Design, Automation and Test in Europe Conference and Exhibition, DATE 2023 - Proceedings. Institute of Electrical and Electronics Engineers (IEEE), 6 p. (Proceedings -Design, Automation and Test in Europe, DATE; vol. 2023-April).Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review
Open AccessFile2 Citations (Scopus)18 Downloads (Pure) -
Device-Aware Test for Ion Depletion Defects in RRAMs
Xun, H., Yuan, S., Fieback, M., Taouil, M., Hamdioui, S. & Aziza, H., 2023, Proceedings of the 2023 IEEE International Test Conference (ITC). Ceballos, C. (ed.). Piscataway: IEEE, p. 246-255 10 p. (Proceedings - International Test Conference).Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review
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Magnetic Coupling Based Test Development for Contact and Interconnect Defects in STT-MRAMs
Yuan, S., Zhang, Z., Fieback, M., Xun, H., Marinissen, E. J., Kar, G. S., Rao, S., Couet, S., Taouil, M. & Hamdioui, S., 2023, Proceedings - 2023 IEEE International Test Conference, ITC 2023. Institute of Electrical and Electronics Engineers (IEEE), p. 236-245 10 p. (Proceedings - International Test Conference).Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review
1 Citation (Scopus)