Research output per year
Research output per year
Fingerprint
Dive into the research topics where H.A. Martin is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
- 1 Similar Profiles
Network
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
Research output
- 1 Conference contribution
-
In-situ reliability monitoring of power packages using a Thermal Test Chip
Martin, H. A., Sattari, R., Smits, E. C. P., van Zeijl, H. W., van Driel, W. D. & Zhang, G. Q., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. IEEE , p. 1-10 10 p. 9758913. (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review