H.W. van Zeijl

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2023

Thermal test chip
van Zeijl, H. W., Zhang, K. & Sattari, R., 2023, IPC No. G01R, H01L, G01N, Priority date 29 Oct 2021, Priority No. WO 2023/075598
Research output: Patent
2018

Three dimensional thermoacoustic device composed of nanoporous material and the method to fabricate such a device
Poelma, R., Zhang, G. Q., Yi, H. & van Zeijl, H., 2018, IPC No. H04R, Priority date 1 Aug 2016, Priority No. NL 2017268
Research output: Patent
2017

Insitu 3D Wafer Level Monitor/Control Unit for LED Color-shifting
Zhang, G. Q., Kolahdouz Esfahani, Z. & van Zeijl, H., 2017, IPC No. H05B; H01L, Priority date 9 Oct 2015, Priority No. NL 2015596
Research output: Patent
2014

Through-Polymer-Via for 3D heterogeneous integration and packaging, and method of manufacture thereof
Poelma, RH., Zhang, GQ. & van Zeijl, HW., 2014, Patent No. 2010077, Priority date 3 Jul 2014
Research output: Patent

Research output