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J. Li

 https://orcid.org/0000-0002-0155-2742
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  • 3 Conference contribution
  • 1 Article

  • Cavity‐box soi: Advanced silicon substrate with pre‐patterned box for monolithic mems fabrication

    Kluba, M. M., Li, J., Parkkinen, K., Louwerse, M., Snijder, J. & Dekker, R., 2021, In: Micromachines. 12, 4, 11 p., 414.

    Research output: Contribution to journal › Article › Scientific › peer-review

    Open Access
    File
    1 Citation (Scopus)
    27 Downloads (Pure)

  • Embedded High-Density Trench Capacitors for Smart Catheters

    Li, J., Naaborg, J., Louwerse, M., Henneken, V., Eugeni, C. & Dekker, R., 2020, Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020. IEEE , p. 1-5 5 p. 9229800. (Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020).

    Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

    File
    1 Citation (Scopus)
    29 Downloads (Pure)

  • Optical Data link Module for Data Transmission in Smart Catheters

    Li, J., Henneken, V. A., Louwerse, M. C. & Dekker, R., 2020, 53rd International Symposium on Microelectronics, IMAPS 2020, October 5-8, 2020, Virtual Symposium. IMAPS, p. 169-173 5 p. (International Symposium on Microelectronics; vol. 2020, no. 1).

    Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

  • Wafer Scale Flexible Interconnect Transfer for Hetrogeneous Integration

    Liu, P., Li, J., van Zeijl, H. & Zhang, G., 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC): Proceedings. O'Conner, L. (ed.). Piscataway: IEEE , p. 817-823 7 p. 9159329. (2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020)).

    Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

    Open Access
    File
    4 Citations (Scopus)
    52 Downloads (Pure)