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Research Output

  • 7 Conference contribution
  • 1 Article
  • 1 Dissertation (TU Delft)

MIP plasma decapsulation of copper¿wired semiconductor devices for failure analysis

Tang, J., 2014, Delft, The Netherlands. 156 p.

Research output: ThesisDissertation (TU Delft)

Open Access

Microwave induced plasma decapsulation of stressed and delaminated high pin-count copper wire bonded IC packages

Tang, J., Chen, CH., Liang, SK., Reinders, EGJ., Revenberg, CTA., Schelen, JBJ. & Beenakker, CIM., 2013, Proceedings 63rd Electronic Components and Technology Conference (ECTC 2013). Sauter, W. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1717-1723 7 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
2 Citations (Scopus)

Decapsulation of high pin count IC packages with palladium coated copper wire bonds using an atmospheric pressure plasma

Tang, J., Reinders, EGJ., Revenberg, CTA., Schelen, JBJ. & Beenakker, CIM., 2012, Proceedings 2012 IEEE 14th Electronics Packaging Technology Conference. Khan, N., Anand, A. & Yeo, A. (eds.). Piscataway, NJ, USA: IEEE Society, p. 165-169 5 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
4 Citations (Scopus)

Fast etching of molding compound by an Ar/O2/CF4 plasma and process improvements for semiconductor package decapsulation

Tang, J., Gruber, D., Schelen, JBJ., Funke, H-J. & Beenakker, CIM., 2012, In : ECS Journal of Solid State Science and Technology. 1, 4, p. 175-178 4 p.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
8 Citations (Scopus)

Flexible system for real-time plasma decapsulation of copper wire bonded ic packages

Tang, J., Schelen, JBJ. & Beenakker, CIM., 2012, Electronic components and technology conference. McCann, D. (ed.). s.l.: IEEE Society, p. 1764-1769 6 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
7 Citations (Scopus)