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M.C. van der Maas

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  • 1 Conference contribution

  • 3D Integration for Modular Quantum Computer based on Diamond Spin Qubits

    Ishihara, R., Hermias, J., Neji, S., Yu, K. Y., Van Der Maas, M., Nur, S., Iwai, T., Miyatake, T., Miyahara, S. & More Authors, 2023, Proceedings of the 2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023. Piscataway: IEEE, 3 p.

    Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

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