Hu, D.,
Wang, C.,
Li, Z.,
Gupta, N.,
Poelma, R. H.,
Shi, Z.,
Fan, J. &
Zhang, G.,
2024,
Proceedings of the 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE,
9 p. (International Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems).
Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review