Research output per year
Research output per year
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Dive into the research topics where P. Sun is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Research output
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Topological Approach to Measure the Recoverability of Optical Networks
Sun, P., He, Z., Kooij, R. E. & Van Mieghem, P., 2021, In : Optical Switching and Networking. 41, p. 1-13 13 p., 100617.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile -
Using Machine Learning to Quantify the Robustness of Network Controllability
Dhiman, A., Sun, P. & Kooij, R., 2021, Machine Learning for Networking - Third International Conference, MLN 2020, Revised Selected Papers. Renault, É., Boumerdassi, S. & Mühlethaler, P. (eds.). Springer, p. 19-39 21 p. (Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics); vol. 12629 LNCS).Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review
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Quantifying the Robustness of Network Controllability
Sun, P., Van Mieghem, P., Kooij, R. E., He, Z. & Van Mieghem, P., 2019, 4th International Conference on System Reliability and Safety (ICSRS): 20-22 November, Rome, Italy. p. 66-76 11 p.Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific
Open AccessFile -
Topological Approach to Measure Network Recoverability
He, Z., Sun, P. & Van Mieghem, P., 2019, Proceedings of 2019 11th International Workshop on Resilient Networks Design and Modeling, RNDM 2019. Ellinas, G., Rak, J. & Goscien, R. (eds.). Institute of Electrical and Electronics Engineers (IEEE), 7 p. 8949119Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review
Open AccessFile -
Compensation Method for Die Shift in Fan-Out Packaging
Sun, Y., Hou, F., Chen, F., Liu, H., Zhang, H., Sun, P., Lin, T. & Cao, L., 2018, 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018: Proceedings . Ye, T., Xiao, F., Wang, J. & Chen, L. (eds.). Piscataway: IEEE , p. 1681-1686 6 p. 8480551Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review
1 Citation (Scopus)
Prizes
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2019 James P. G. Sterbenz best paper award
He, Z. (Recipient), Sun, P. (Recipient) & Van Mieghem, P.F.A. (Recipient), 16 Oct 2019
Prize: Prize (including medals and awards)