Research output per year
Research output per year
Search results
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2023
A Thin-film Reconfigurable SiC Thermal Test Chip for Reliability Monitoring in Harsh Environments
Sattari, R., Van Zeijl, H. & Zhang, G., 2023, Proceedings of the 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC). IEEE, p. 1309-1313 5 p. (Proceedings - Electronic Components and Technology Conference; vol. 2023-May).Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review
Open AccessFile22 Downloads (Pure) -
Design, Fabrication, and Characterization of a 4H-SiC CMOS Readout Circuit for Monolithic Integration with SiC Sensors
Sattari, R., van Zeijl, H. & Zhang, G., 2023, Proceedings of the 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE, p. 1-3 3 p. (24th European Microelectronics and Packaging Conference, EMPC 2023).Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review
Open AccessFile6 Downloads (Pure) -
Design and Manufacturing of an In-Package Relative Humidity Sensor with Multi-Width Interdigital Electrodes Towards Enhanced Sensitivity for Characterization of Packaging Encapsulation Materials
Sattari, R., van Zeijl, H. & Zhang, G., 2023, Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023. Tay, A., Chui, K. J., Lim, Y. K., Tan, C. S. & Shin, S. (eds.). IEEE, p. 588-591 4 p. (Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023).Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review
Open AccessFile3 Downloads (Pure) -
Manufacturing of an In-Package Relative Humidity Sensor for Epoxy Molding Compound Packages
Sattari, R., van Zeijl, H. & Zhang, G., 2023, Proceedings of the 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, p. 1-6 6 p. (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review
Open AccessFile2 Citations (Scopus)41 Downloads (Pure) -
2022
In-situ reliability monitoring of power packages using a Thermal Test Chip
Martin, H. A., Sattari, R., Smits, E. C. P., van Zeijl, H. W., van Driel, W. D. & Zhang, G. Q., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. IEEE, p. 1-10 10 p. 9758913. (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review
Open AccessFile5 Citations (Scopus)132 Downloads (Pure) -
2021
Design and Fabrication of a Multi-Functional Programmable Thermal Test Chip
Sattari, R., van Zeijl, H. & Zhang, G., 2021, 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC): Proceedings. IEEE, p. 1-7 7 p. 9584984Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review
Open AccessFile219 Downloads (Pure)