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Research Output

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Conference contribution
2018

Designing a 100 [aF/nm] capacitive transducer

Middelburg, L. M., Mansouri, B. E., Poelma, R. H., Van Zeijl, H. W., Wei, J., Zhang, G. Q. & Van Driel, W. D., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-3 3 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
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24 Downloads (Pure)

Non-linear bulk micromachined accelerometer for high sensitivity applications

Middelburg, L. M., Mansouri, B. E., Poelma, R., Zhang, G. Q., van Zeijl, H. & Wei, J., 2018, 2018 IEEE SENSORS Proceedings. Roy, A. & Gianchandani, Y. (eds.). Piscataway, NJ: IEEE, Vol. 2018-October. p. 1-4 4 p. 8589630

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
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51 Downloads (Pure)

Wafer Level Through Polymer Optical Vias (TPOV) Enabling High Throughput of Optical Windows Manufacturing

Huang, Z. Q., Poelma, R. H., Vollebregt, S., Koelink, M. H., Boschman, E., Kropf, R., Gallouch, M. & Zhang, G. Q., 2018, 2018 7th Electronic System-Integration Technology Conference (ESTC). IEEE, p. 1-5 5 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
File
27 Downloads (Pure)
2017

High aspect ratio spiral resonators for process variation investigation and MEMS applications

Middelburg, L. M., Mansouri, B. E., Van Zeijl, H. W., Zhang, G. Q. & Poelma, R. H., 2017, Proceedings of IEEE Sensors Conference 2017. Piscataway, NJ: IEEE, p. 1-3 3 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
File
12 Downloads (Pure)

Prognostics & health management for LED-based applications

van Driel, W., Jacobs, B., Schenkelaars, D., Klompenhouwer, M., Poelma, R., El Mansouri, B. & Middelburg, L., 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. IEEE, p. 1-4 4 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Smart Systems Integration in the era of Solid State Lighting

van Driel, W., Zhang, G. Q., van Zeijl, H., Poelma, R., Koladouz Esfahani, Z., Ramachandrappa Venkatesh, M., Middelburg, L. & El Mansouri, B., 2017, Smart Systems Integration 2017: International Conference and Exhibition on Integration Issues of Miniaturized Systems. Otto, T. (ed.). Frankfurt: Mesago Messe Frankfurt GmbH, p. 160-165 6 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

2016

3D interconnect technology based on low temperature copper nanoparticle sintering

Zhang, B., Carisey, Y., Damian, A., Poelma, R., Zhang, G. Q. & van Zeijl, H., 2016, Proceedings of the 17th International Conference on Electronic Packaging Technology (ICEPT). Bi, K., Liu, S. & Zhou, S. (eds.). IEEE, p. 1163-1167

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
File
3 Citations (Scopus)
52 Downloads (Pure)

Metallic Nanoparticle Based Interconnect for Heterogeneous 3D Integration

van Zeijl, H., Carisey, Y., Damian, A., Poelma, R., A, Z. & Zhang, G. Q., 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC). O'Conner, L. (ed.). Piscataway: IEEE, p. 217-224 8 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

4 Citations (Scopus)

Tailoring material properties for 3D microfabrication: In-situ experimentation and multi-scale modelling

Poelma, R., Fan, X. J., Schlangen, E., van Zeijl, H. & Zhang, G. Q., 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, p. 1-6 6 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

2015

Through-polymer-via for 3D heterogeneous integration and packaging

Hamelink, J., Poelma, R. & Kengen, M., Dec 2015, 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC). IEEE Society, p. 1-7 7 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Tunable binary Fresnel lens based on stretchable PDMS/CNT composite

Li, X., Wei, L., Vollebregt, S., Poelma, RH., Shen, Y., Wei, J., Urbach, HP., Sarro, PM. & Zhang, GQ., 2015, Proceedings of the 2015 Transducers - 2015 18th Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS. Kenny, TW. & Bright, VM. (eds.). Piscataway: IEEE Society, p. 2041-2044 4 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
5 Citations (Scopus)
2013

A new self-sealing thin-film encapsulation process for MEMS

Santagata, F., Zaccaria, I., Poelma, RH., Creemer, JF., Zhang, GQ. & Sarro, PM., 2013, Proceedings 17th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXVII. Morante, JR. & Hierold, C. (eds.). Piscataway, NJ, USA: IEEE Society, p. 822-825 4 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access

Low temperature hybrid wafer bonding for 3D integration

Damian, AA., Poelma, RH., van Zeijl, HW. & Zhang, GQ., 2013, Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013). Zhang, GQ. (ed.). Piscataway, NJ: IEEE Society, p. 1-5 5 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

1 Citation (Scopus)

Transfer molding of primary LED optics: High aspect ratio domes

Kersjes, S. H. M., Zijl, J. L. J., Poelma, R. & Wensink, H. W., 2013, 2013 Eurpoean Microelectronics Packaging Conference (EMPC). Piscataway: IEEE, p. 1-6 6 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

2 Citations (Scopus)
2012

Establishment of the coarse grained parameters for epoxy-copper interfacial separation

Wong, KY., Leung, YY., Poelma, RH., Jansen, KMB., Yuan, CA., van Driel, WD. & Zhang, GQ., 2012, Electronic packaging technology and high density packaging (ICEPT-HDP), 2012 Proceedings of the 13th international conference. s.n. (ed.). Piscataway: IEEE Society, p. 1467-1473 7 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access

Establishment of the mesoscale parameters for epoxy-copper interfacial separation

Wong, CKY., Leung, SYY., Poelma, RH., Jansen, KMB., Yuan, CCA., van Driel, WD. & Zhang, GQ., 2012, 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE 2012). s.l.: IEEE Society, p. 1-6 6 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

3 Citations (Scopus)

Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems

Santagata, F., Fiorentino, G., Nie, M., Farriciello, C., Poelma, RH., Zhang, GQ. & Sarro, PM., 2012, Proceedings 11th IEEE Sensors Conference. Fang et al, W. (ed.). Piscataway, NJ, USA: IEEE Society, p. 668-671 4 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

1 Citation (Scopus)
2011

Buckling analysis of carbon nanotubes and the influence of defect position

Poelma, RH., Sadeghian Marnani, H., Koh, SW. & Zhang, GQ., 2011, 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2011). Ernst, LJ., Zhang, GQ., Driel, WD. V. & et al. (eds.). Piscataway, NJ: IEEE Society, p. 1-7 7 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

2 Citations (Scopus)

Molecular dynamics study of the traction-displacement relations of epoxy-copper interfaces

Wong, CKY., Leung, SYY., Poelma, RH., Jansen, KMB., Yuan, CA., van Driel, WD. & Zhang, GQ., 2011, 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2011). Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Piscataway: IEEE Society, p. 1-5 5 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

1 Citation (Scopus)
2010

Multi-scale numerical-experimental method to determine the size dependent elastic properties of bilayer silicon copper nanocantilevers using an electrostatic pull in experiment

Poelma, RH., Sadeghian Marnani, H., Noijen, SPM., Zaal, JJM. & Zhang, GQ., 2010, Proceedings of the 11th International Conference on Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) 2010. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C. & Saint Leger, O. de (eds.). Bordeaux, France: EuroSimE, p. 1-9 9 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

1 Citation (Scopus)