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  • 2023

    3D Integration for Modular Quantum Computer based on Diamond Spin Qubits

    Ishihara, R., Hermias, J., Neji, S., Yu, K. Y., Van Der Maas, M., Nur, S., Iwai, T., Miyatake, T., Miyahara, S. & More Authors, 2023, Proceedings of the 2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023. Piscataway: IEEE, 3 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

    Open Access
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    125 Downloads (Pure)
  • Cryogenic Integration for Quantum Computer Using Diamond Color Center Spin Qubits

    Iwai, T., Kawaguchi, K., Miyatake, T., Ishiguro, T., Miyahara, S., Doi, Y., Nur, S., Ishihara, R. & Sato, S., 2023, Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023. IEEE, p. 967-972 6 p. (Proceedings - Electronic Components and Technology Conference; vol. 2023-May).

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

    Open Access
    File
    1 Citation (Scopus)
    98 Downloads (Pure)
  • 2021

    3D Integration Technology for Quantum Computer based on Diamond Spin Qubits

    Ishihara, R., Hermias, J., Yu, S., Yu, K. Y., Nur, S., Iwai, T., Miyatake, T., Kawaguchi, K., Doi, Y., Sato, S. & LI, Y., 2021, 2021 IEEE International Electron Devices Meeting, IEDM 2021. IEEE, p. 14.5.1-14.5.4 (Technical Digest - International Electron Devices Meeting, IEDM; vol. 2021-December).

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

    2 Citations (Scopus)