Bakhshaee Babaroud, N.,
Dekker, R.,
Holk, O.,
Tiringer, U.,
Taheri, P.,
Horvath, D.,
Nanasi, T.,
Ulbert, I.,
Serdijn, W. &
Giagka, V.,
2021,
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC): Proceedings. IEEE,
p. 1-7 7 p. 9584961
Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review