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Personal profile

External positions

Research Group Leader, Fraunhofer Institute for Reliability and Microintegration IZM

1 Sep 2018 → …

Fingerprint Dive into the research topics where V. Giagka is active. These topic labels come from the works of this person. Together they form a unique fingerprint.

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Research Output

A Chip Integrity Monitor for Evaluating Moisture/Ion Ingress in mm-Sized Single-Chip Implants

Akgun, O. C., Nanbakhsh, K., Giagka, V. & Serdijn, W., Aug 2020, In : IEEE Transactions on Biomedical Circuits and Systems. 14, 4, p. 658-670 13 p., 9134882.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
File
  • 4 Downloads (Pure)

    Bidirectional Bioelectronic Interfaces: System Design and Circuit Implications: System Design and Circuit Implications

    Liu, Y., Urso, A., Martins Da Ponte, R., Costa, T., Valente, V., Giagka, V., Serdijn, W. A., Constandinou, T. G. & Denison, T., 2020, In : IEEE Solid State Circ. Mag.. 12, 2, p. 30-46 17 p.

    Research output: Contribution to journalArticleScientificpeer-review

  • Circuit Design Considerations for Power-Efficient and Safe Implantable Electrical Neurostimulators

    Guan, R., Zufiria, P. G., Giagka, V. & Serdijn, W., 2020, 2020 IEEE 11th Latin American Symposium on Circuits & Systems (LASCAS). IEEE, 4 p. 9068975

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

    Open Access
    File
  • 9 Downloads (Pure)

    Long-term Encapsulation of Platinum Metallization Using a HfO2 ALD - PDMS Bilayer for Non-hermetic Active Implants

    Nanbakhsh, K., Ritasalo, R., Serdijn, W. A. & Giagka, V., 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC). O'Conner, L. & Torres, H. (eds.). Piscataway: IEEE, p. 467-472 6 p. 9159261

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  • 2 Citations (Scopus)

    PDMS-Parylene Adhesion Improvement via Ceramic Interlayers to Strengthen the Encapsulation of Active Neural Implants

    Bakhshaee Babaroud, N., Dekker, R., Serdijn, W. & Giagka, V., 2020, 2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC): Proceedings. Danvers: IEEE, p. 3399-3402 4 p. 9175646

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  • Activities

    • 2 Talk or presentation at a conference

    Circuit and Systems for Polymeric Implants: Designing Towards Increased Device Lifetimes

    Kambiz Nanbakhsh (Speaker), , Vasiliki Giagka (Speaker), & Wouter Serdijn (Speaker)

    7 Jun 20188 Jun 2018

    Activity: Talk or presentationTalk or presentation at a conference

    MEMS-Electronics Integration: A Smart Temperature Sensor for an Organ-on-a-chip Platform

    Ronaldo Martins da Ponte (Speaker), , Vasiliki Giagka (Speaker), & Wouter Serdijn (Speaker)

    7 Jun 20188 Jun 2018

    Activity: Talk or presentationTalk or presentation at a conference