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  • 2022

    Degradation and Failures of Polymers Used in Light-Emitting Diodes

    Mehr, M. Y., Driel, W. D. V. & Zhang, G., 2022, Reliability of Organic Compounds in Microelectronics and Optoelectronics: From Physics-of-Failure to Physics-of-Degradation. van Driel, W. D. & Mehr, M. Y. (eds.). Springer, p. 241-257 17 p.

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  • Outlook: From Physics of Failure to Physics of Degradation

    Driel, W. D. V., Mehr, M. Y., Fan, X. J. & Zhang, G., 2022, Reliability of Organic Compounds in Microelectronics and Optoelectronics: From Physics-of-Failure to Physics-of-Degradation . van Driel, W. D. & Mehr, M. Y. (eds.). Springer, p. 535-538 4 p.

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  • Reliability and Failures in Solid State Lighting Systems

    Driel, W. D. V., Jacobs, B. J. C., Onushkin, G., Watte, P., Zhao, X. & Davis, J. L., 2022, Reliability of Organic Compounds in Microelectronics and Optoelectronics: From Physics-of-Failure to Physics-of-Degradation. van Driel, W. D. & Mehr, M. Y. M. (eds.). Springer, p. 211-240 30 p.

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  • 2020

    From Si Towards SiC Technology for Harsh Environment Sensing

    Middelburg, L., van Driel, W. & Zhang, K., 2020, Sensor Systems Simulations: From Concept to Solution. van Driel, W. D., Pyper, O. & Schumann, C. (eds.). Springer, p. 1-15 15 p.

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  • Health Monitoring for Lighting Applications

    van Driel, W., Middelburg, L., el Mansouri, B. & B.J.C., JA., 2020, Sensor Systems Simulations: From Concept to Solution. van Driel, W. D., Pyper, O. & Schumann, C. (eds.). Springer, p. 367-395

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  • Ultraviolet Sensing in WBG: SiC

    Mansouri, B. E., Driel, W. D. V. & Zhang, G., 2020, Sensor Systems Simulations. van Driel, W., Pyper, O. & Schumann, C. (eds.). Cham: SpringerOpen, p. 397-425 29 p.

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  • 2018

    Advances in delamination modeling of metal/polymer systems: Atomistic aspects

    Van Der Sluis, O., Iwamoto, N., Qu, J., Yang, S., Yuan, C., Van Driel, W. D. & Zhang, G. Q., 1 Jan 2018, Nanopackaging: Nanotechnologies and Electronics Packaging, Second Edition. Springer, p. 129-183 55 p.

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  • Corrosion Sensitivity of LED Packages

    Jacobs, B. J. C., van der Marel, C., van Driel, W. D. (ed.), Lu, S. J. & Li, X. P., 2018, Solid State Lighting Reliability Part 2: Components to Systems. van Driel, W. D., Fan, X. & Zhang, G. Q. (eds.). 1 ed. Cham: Springer, p. 527-547 21 p. (Solid State Lighting Technology and Application Series; vol. 3).

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  • LED-Based Luminaire Color Shift Acceleration and Prediction

    Lu, G., van Driel, W. D. (ed.), Fan, X., Fan, J. & Zhang, G. Q., 2018, Solid State Lighting Reliability Part 2: Components to Systems. van Driel, W. D., Fan, X. & Zhang, G. Q. (eds.). 1 ed. Cham: Springer, p. 201-219 19 p. (Solid State Lighting Technology and Application Series; vol. 3).

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  • Lightning Effects on LED-Based Luminaires

    Agbemuko, A., van Meurs, J. & van Driel, W. D., 2018, Solid State Lighting Reliability Part 2: Components to Systems. van Driel, W. D., Fan, X. & Zhang, G. Q. (eds.). 1 ed. Cham: Springer, p. 573-583 11 p. (Solid State Lighting Technology and Application Series; vol. 3).

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  • Quality and Reliability in Solid-State Lighting: Qua Vadis?

    Vos, T., den Breeijen, P. & van Driel, W. D., 2018, Solid State Lighting Reliability Part 2: Components to Systems. van Driel, W. D., Fan, X. & Zhang, G. Q. (eds.). 1 ed. Cham: Springer, p. 1-13 13 p. (Solid State Lighting Technology and Application Series; vol. 3).

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  • Reliability and Lifetime Assessment of Optical Materials in LED-Based Products

    Yazdan Mehr, M., van Driel, W. & Zhang, G. Q., 2018, Solid State Lighting Reliability Part 2: Components to Systems. van Driel, W. D., Fan, X. & Zhang, G. Q. (eds.). 1 ed. Cham: Springer, p. 115-139 25 p. (Solid State Lighting Technology and Application Series; vol. 3).

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  • Reliability Prediction of Integrated LED Lamps with Electrolytic Capacitor-Less LED Drivers

    Sun, B., Fan, X., van Driel, W. D. (ed.) & Zhang, G. Q., 2018, Solid State Lighting Reliability Part 2: Components to Systems. van Driel, W. D., Fan, X. & Zhang, G. Q. (eds.). 1 ed. Cham: Springer, p. 455-486 32 p. (Solid State Lighting Technology and Application Series; vol. 3).

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  • Statistical Analysis of Lumen Depreciation for LED Packages

    Schuld, M., van Driel, W. D. (ed.) & Jacobs, B., 2018, Solid State Lighting Reliability Part 2: Components to Systems. van Driel, W. D., Fan, X. & Zhang, G. Q. (eds.). 1 ed. Cham: Springer, p. 487-502 16 p. (Solid State Lighting Technology and Application Series; vol. 3).

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  • The Next Frontier: Reliability of Complex Systems

    Schenkelaars, D., van Driel, W. D. (ed.) & Duijve, R., 2018, Solid State Lighting Reliability Part 2: Components to Systems. van Driel, W. D., Fan, X. & Zhang, G. Q. (eds.). 1 ed. Cham: Springer, p. 585-595 11 p. (Solid State Lighting Technology and Application Series; vol. 3).

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  • 2016

    Tools and methods for validation and verification

    Jaramillo, P., Pruteanu, A., van Driel, W., van Kooten, W. & Linnartz, J. P., 1 Jan 2016, Internet of Things. 9789811007149 ed. Springer, p. 113-136 24 p. (Internet of Things; no. 9789811007149).

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientificpeer-review

  • 2015

    Establishment of the mesoscale parameters for separation: A nonequilibrium molecular dynamics model

    Wong, CKY., Leung, SYY., Poelma, RH., Jansen, KMB., Yuan, CCA., van Driel, WD. & Zhang, GQ., 2015, Molecular modeling and multiscaling issues for electronic material applications - Volume 2. Wymyslowski, A., Iwamoto, N., Yuen, M. & Fan, H. (eds.). Cham, Switzerland: Springer, p. 133-148 194 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

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  • 2014

    System Level Reliability for Solid State Lighting Applications

    van Driel, W., Zhang, G. Q., Koh, S. & Fan, X., 16 Dec 2014, Smart systems integration for micro- and nanotechnologies : honorary volume on the occasion of Thomas Gessner's 60th birthday. Gessner, T. & Michel, B. (eds.). Fraunhofer Verlag, p. 155-166 11 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

  • 2013

    Degradation Mechanisms in LED Packages

    Koh, S., van Driel, W., Yuan, C. & Zhang, G. Q., Jul 2013, Solid State Lighting Reliability. van Driel, W. D. & Fan, X. J. (eds.). New York: Springer, p. 185-205 20 p. (Solid State Lighting Technology and Application Series; vol. 1).

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

    2 Citations (Scopus)
  • Solder Joint Reliability in Solid-State Ligting Application

    Kloosterman, J., Kregting, R., Erinc, M. & van Driel, W., Jan 2013, Solid State Lighting Reliability. New York, NY: Springer, p. 285-305 20 p. (Solid State Lighting Technology and Application Series; vol. SSLTA 1).

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

    1 Citation (Scopus)
  • 2012

    Fault Tolerant Control of Large LED Systems

    Dong, J., van Driel, W. & Zhang, G. Q., 12 Jul 2012, Solid State Lighting Reliability: Components to Systems. New York: Springer, p. 395-412 17 p. (Part of the Solid State Lighting Technology and Application Series book series; vol. 1).

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

  • Semi empirical low cycle fatigue crack growth analysis of nanostructure chip-to-package copper interconnect using molecular simulation

    Koh, SW., Saxena, A., van Driel, WD., Zhang, GQ. & Tummala, R., 2012, Molecular Modeling and Multiscaling Issues for Electronic Material Applications. Iwamoto, N., Yuen, MMF. & Fan, H. (eds.). New York: Springer, p. 77-90 260 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

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    1 Citation (Scopus)
  • The mechanical properties modeling of nano-scale materials by molecular dynamics

    Yuan, C., van Driel, WD., Poelma, RH. & Zhang, GQ., 2012, Molecular Modeling and Multiscaling Issues for Electronic Material Applications. Iwamoto, N., Yuen, MMF. & Fan, H. (eds.). New York: Springer, p. 115-131 258 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

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  • 2010

    Challenges for MEMS Packaging Reliability

    Zaal, JJM., van Driel, WD. & Zhang, GQ., 2010, Smart Systems Integration and Reliability. Honorary volume on the occasion of Herbert Reichl's 65th birthday. Michel, Bernd & Lang, Klaus-Dieter (eds.). Dresden, Germany: Goldenbogen Verlag, p. 246-254

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

  • Fracture and Delamination in Microelectronic Devices.

    Ernst, LJ., van Driel, WD., van der Sluis, O., Corigliano, A. & Tay, AAO., 2010, Smart systems integration and reliability.. Bernd, M. & Klaus-Dieter, L. (eds.). Dresden: Goldenbogen Verlag, p. 634-663 824 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

  • Industrial applications of moisture-related reliability problems

    van Driel, WD., Yang, D., Yuan, CA. & Zhang, GQ., 2010, Moisture Sensitivity of Plastic Packages of IC Devices. Fan, XJ. & Suhir, E. (eds.). New York Dordrecht Heidelberg London: Springer, p. 411-434 555 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

  • 2008

    Advances in delamination modeling

    van der Sluis, O., Yuan, CA., van Driel, WD. & Zhang, GQ., 2008, Nanopackaging: Nanotechnologies and Electronics Packaging. Morris, JE. (ed.). Springer, p. 1-34 549 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientificpeer-review

  • Morphology, Evolution and Performance of IMC in SAC105 Solder/UBM (Ni (P)-Au)

    Sun, F. L., Hochstenbach, P., Van Driel, W. D. & Zhang, G. Q., 2008, 2008 International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP 2008), Shanghai, China. IEEE , p. 1-4 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientificpeer-review

  • The Role of the Molecular Simulation Approach for IC-backend Developments

    Yuan, C., van der Sluis, O., van Driel, W. D. & Zhang, G. Q., 2008, 2008 International Conference on Electronics Packaging Technology and High Density Packaging. IEEE , 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientificpeer-review

  • 2007

    Virtual Thermo-Mechanical Prototyping of Microelectronics and Microsystems

    Wymyslowski, A., Zhang, GQ., van Driel, WD. & Ernst, LJ., 2007, Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging. Suhir, E., Lee, YC. & Wong, CP. (eds.). New York, NY, USA: Springer, p. 205-266 701 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientificpeer-review