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Research Output

  • 1 Conference contribution
  • 1 Article
  • 1 Review article

Optimization of mesa etch for a quasi-vertical gan schottky barrier diode (Sbd) by inductively coupled plasma (icp) and device characteristics

Sun, Y., Kang, X., Zheng, Y., Wei, K., Li, P., Wang, W., Liu, X. & Zhang, G., 2020, In : Nanomaterials. 10, 4, p. 1-13 13 p., 657.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
File
  • 16 Downloads (Pure)

    Review of the recent progress on GaN-based vertical power Schottky barrier diodes (SBDs)

    Sun, Y., Kang, X., Zheng, Y., Lu, J., Tian, X., Wei, K., Wu, H., Wang, W., Liu, X. & Zhang, G., 2019, In : Electronics (Switzerland). 8, 5, p. 1-15 15 p., 575.

    Research output: Contribution to journalReview articleScientificpeer-review

    Open Access
    File
  • 9 Citations (Scopus)
    46 Downloads (Pure)

    Compensation Method for Die Shift in Fan-Out Packaging

    Sun, Y., Hou, F., Chen, F., Liu, H., Zhang, H., Sun, P., Lin, T. & Cao, L., 2018, 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018: Proceedings . Ye, T., Xiao, F., Wang, J. & Chen, L. (eds.). Piscataway: IEEE, p. 1681-1686 6 p. 8480551

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  • 1 Citation (Scopus)