Y. Sun

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Y. Sun

 https://orcid.org/0000-0002-6366-4299
  • 5 Article
  • 1 Conference contribution
  • 1 Review article
  • 1 Dissertation (TU Delft)
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Conference contribution

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  • 2018

    Compensation Method for Die Shift in Fan-Out Packaging

    Sun, Y., Hou, F., Chen, F., Liu, H., Zhang, H., Sun, P., Lin, T. & Cao, L., 2018, 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018: Proceedings . Ye, T., Xiao, F., Wang, J. & Chen, L. (eds.). Piscataway: IEEE, p. 1681-1686 6 p. 8480551

    Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

    2 Citations (Scopus)