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Z. Cui
Electrical Engineering, Mathematics and Computer Science
,
Electronic Components, Technology and Materials
https://orcid.org/0000-0002-9453-5537
2018
2020
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Chemical Compounds
Adhesion
Atmospheric humidity
Cerium
Chemical bonds
Chemical elements
Color
Composite materials
Copper
Crystal structure
Curing
Degradation
Density functional theory
Dissolution
Electric Conductivity
Electromigration
Electronic equipment
Electronics packaging
Energy barriers
Epoxy Resins
Fillers
Hydrogen bonds
Hydrolysis
Ions
Light emission
Light emitting diodes
Metals
Ointments
Packaging
Phosphors
Photoluminescence
Polyvinyls
Printing
Pyrrolidinones
Reaction kinetics
Reaction rates
Semiconductor devices
Semiconductor lasers
Silicones
Silver
Substrates
Water
Yttrium aluminum garnet
yttrium-aluminum-garnet
Physics & Astronomy
adhesion
boundary conditions
cerium
chemical elements
coalescing
color
composite materials
conservation equations
constitutive equations
crashes
current density
degradation
density functional theory
electromigration
gradients
grain boundaries
humidity
hydrolysis
hydrostatics
kinetics
light emission
light emitting diodes
mechanical properties
metals
modulus of elasticity
moisture
molecular dynamics
nanoparticles
packaging
phosphors
plastic flow
reaction kinetics
silicones
simulation
sintering
strain rate
surface diffusion
temperature
tensile strength
trajectories
voids
water immersion
yttrium-aluminum garnet
Engineering & Materials Science
Adhesion
Chemical bonds
Composite materials
Copper
Curing
Density functional theory
Electromigration
Electronic equipment
Electronics packaging
Energy barriers
Epoxy resins
Fillers
Hydrogen bonds
Hydrolysis
Ions
Light emitting diodes
Metals
Packaging
Phosphors
Printing
Semiconductor devices
Silicones
Silver
Substrates