If you made any changes in Pure these will be visible here soon.

Research Output

  • 4 Article
  • 3 Conference contribution
2020

Hydrolysis kinetic study of CaAlSiN3:Eu2+ red phosphor with both water immersion test and first-principles calculation

Fan, J., Zhou, L., Cui, Z., Chen, S., Fan, X. & Zhang, G., 1 Mar 2020, In : Journal of Luminescence. 219, p. 1-11 11 p., 116874.

Research output: Contribution to journalArticleScientificpeer-review

3 Citations (Scopus)

Implementation of General Coupling Model of Electromigration in ANSYS

Cui, Z., Fan, X. & Zhang, G., 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC). O'Conner, L. & Torres, H. (eds.). Piscataway: IEEE, p. 1632-1637 6 p. 9159445

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
File
2 Downloads (Pure)

The interface adhesion of CaAlSiN3: Eu2+ phosphor/silicone used in light-emitting diode packaging: A first principles study

Cui, Z., Fan, J., van Ginkel, H. J., Fan, X. & Zhang, G., 30 Apr 2020, In : Applied Surface Science. 510, 8 p., 145251.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
File
1 Citation (Scopus)
36 Downloads (Pure)
2019

General coupling model for electromigration and one-dimensional numerical solutions

Cui, Z., Fan, X. & Zhang, G., 2019, In : Journal of Applied Physics. 125, 10, p. 1-9 9 p., 105101.

Research output: Contribution to journalArticleScientificpeer-review

2 Citations (Scopus)

PVP-Mediated Galvanic Replacement Synthesis of Smart Elliptic Cu-Ag Nanoflakes for Electrically Conductive Pastes

Zhang, Y., Zhu, P., Li, G., Cui, Z., Cui, C., Zhang, K., Gao, J., Chen, X., Zhang, G., Sun, R. & Wong, C., 2019, In : ACS Applied Materials and Interfaces. 11, 8, p. 8382-8390 9 p.

Research output: Contribution to journalArticleScientificpeer-review

6 Citations (Scopus)
2018

Interfacial Failure Characterization of Electronic Packaging Component Using a Multiscale Modelling Approach

Cui, Z., Zhang, Y., Yang, Q., Zhang, G. & Chen, X., 2018, Proceedings - 2018 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2018. Piscataway, NJ: IEEE, p. 68-70 3 p. 8421434

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
File
18 Downloads (Pure)

Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages

Cui, Z., Chen, X., Fan, X. & Zhang, G., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-4 4 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
File
13 Downloads (Pure)