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A new physics-motivated constitutive model of hyperelastic polymer networks
Li, Z., Fan, J. & Zhang, G., 2026, In: International Journal of Mechanical Sciences. 314, 18 p., 111366.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile1 Downloads (Pure) -
Long-term high-temperature aging mechanism of copper-metallized through-glass vias: a combined nanoindentation test and hybrid Potts-phase field simulation study
Chen, J., Li, Z., Yang, B., Hu, X., Li, W., Li, Z., Yan, X., Zhang, G., Fan, J. & More Authors, 2026, In: Microsystems and Nanoengineering. 12, 1, 11 p., 46.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile -
Experimental study on the dynamic mechanical response of a blue light-stimulated acrylate side chain liquid crystal elastomer
Li, Z., Wymenga, L., Fan, J. & Zhang, G., 2024, In: Optics Letters. 49, 18, p. 5248-5251 4 p.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile3 Link opens in a new tab Citations (Scopus)11 Downloads (Pure) -
Investigating the Sintering Process and Mechanical Properties of Nano-copper Particles Coupling Particle Packing Modeling with Molecular Dynamics Simulation
Liu, X., Hu, D., Li, Z., Fan, X., Zhang, G. & Fan, J., 2024, Proceedings of the 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, 7 p. (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024).Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review
Open AccessFile17 Downloads (Pure) -
Warpage deformation analysis of AMB ceramic substrates in power modules
Hu, D., Wang, C., Li, Z., Gupta, N., Poelma, R. H., Shi, Z., Fan, J. & Zhang, G., 2024, Proceedings of the 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, 9 p. (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024).Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review
Open AccessFile4 Link opens in a new tab Citations (Scopus)537 Downloads (Pure)