| Event title | Symposium on Solid and Physical Modeling 2019 |
|---|---|
| Location | Vancouver, Canada |
| Period | 17 Jun 2019 → 19 Jun 2019 |
Best paper award (2nd place) from Symposium on Solid and Physical Modeling 2019
- Wu, J. (Recipient), Wang, C.C. (Recipient) & Kuipers, T. (Recipient)
Prize: Prize (including medals and awards)