20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering

Xinrui Ji; Leiming Du; Henk Van Zeijl; Guoqi Zhang; Jaber Derakhshandeh; Eric Beyne

doi:10.1109/ECTC51529.2024.00221

20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering

Xinrui Ji^*, Leiming Du, Henk Van Zeijl, Guoqi Zhang, Jaber Derakhshandeh, Eric Beyne

^*Corresponding author for this work

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

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Abstract

This report demonstrates an innovative method to achieve large scale 20 μm pitch Cu-Cu direct bonding, utilizing lithographic stencil printing to transfer small-sized nano-copper (CuNPs) paste and employs a thermocompression method for CuNPs sintering to establish interconnections between copper-pillars and CuNPs bumps. Shear tests were conducted to characterize the bonding strength. High-throughput 20 μm pitch copper-to-copper direct bonding enables lower annealing temperatures for bulk-Cu to bulk-Cu bonding. Lithographic stencil printing is used to transfer the CuNPs paste, followed by sintering of the nanoparticles to establish interconnections. Shear tests and cross-section SEM were conducted to characterize the bonding strength and quality.

Original language	English
Title of host publication	Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024
Publisher	IEEE
Pages	1891-1895
Number of pages	5
ISBN (Electronic)	9798350375985
DOIs	https://doi.org/10.1109/ECTC51529.2024.00221
Publication status	Published - 2024
Event	74th IEEE Electronic Components and Technology Conference, ECTC 2024 - Denver, United States Duration: 28 May 2024 → 31 May 2024

Publication series

Name	Proceedings - Electronic Components and Technology Conference
ISSN (Print)	0569-5503

Conference

Conference	74th IEEE Electronic Components and Technology Conference, ECTC 2024
Country/Territory	United States
City	Denver
Period	28/05/24 → 31/05/24

Bibliographical note

Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-care
Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

Keywords

all-Cu interconnects
copper nanoparticles
fine pitch
flip chip

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10.1109/ECTC51529.2024.00221

20_m_pitch_Cu-to-Cu_flip-chip_interconnects_through_Cu_nanoparticles_sinteringFinal published version, 1.67 MB

Cite this

Ji, X., Du, L., Van Zeijl, H., Zhang, G., Derakhshandeh, J., & Beyne, E. (2024). 20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering. In Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024 (pp. 1891-1895). (Proceedings - Electronic Components and Technology Conference). IEEE. https://doi.org/10.1109/ECTC51529.2024.00221

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title = "20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering",

abstract = "This report demonstrates an innovative method to achieve large scale 20 μm pitch Cu-Cu direct bonding, utilizing lithographic stencil printing to transfer small-sized nano-copper (CuNPs) paste and employs a thermocompression method for CuNPs sintering to establish interconnections between copper-pillars and CuNPs bumps. Shear tests were conducted to characterize the bonding strength. High-throughput 20 μm pitch copper-to-copper direct bonding enables lower annealing temperatures for bulk-Cu to bulk-Cu bonding. Lithographic stencil printing is used to transfer the CuNPs paste, followed by sintering of the nanoparticles to establish interconnections. Shear tests and cross-section SEM were conducted to characterize the bonding strength and quality.",

keywords = "all-Cu interconnects, copper nanoparticles, fine pitch, flip chip",

author = "Xinrui Ji and Leiming Du and {Van Zeijl}, Henk and Guoqi Zhang and Jaber Derakhshandeh and Eric Beyne",

note = "Green Open Access added to TU Delft Institutional Repository {\textquoteleft}You share, we take care!{\textquoteright} – Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public. ; 74th IEEE Electronic Components and Technology Conference, ECTC 2024 ; Conference date: 28-05-2024 Through 31-05-2024",

year = "2024",

doi = "10.1109/ECTC51529.2024.00221",

language = "English",

series = "Proceedings - Electronic Components and Technology Conference",

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Ji, X , Du, L , Van Zeijl, H , Zhang, G, Derakhshandeh, J & Beyne, E 2024, 20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering. in Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024. Proceedings - Electronic Components and Technology Conference, IEEE, pp. 1891-1895, 74th IEEE Electronic Components and Technology Conference, ECTC 2024, Denver, United States, 28/05/24. https://doi.org/10.1109/ECTC51529.2024.00221

20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering. / Ji, Xinrui ; Du, Leiming ; Van Zeijl, Henk et al.
Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024. IEEE, 2024. p. 1891-1895 (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

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AU - Derakhshandeh, Jaber

AU - Beyne, Eric

N1 - Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

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N2 - This report demonstrates an innovative method to achieve large scale 20 μm pitch Cu-Cu direct bonding, utilizing lithographic stencil printing to transfer small-sized nano-copper (CuNPs) paste and employs a thermocompression method for CuNPs sintering to establish interconnections between copper-pillars and CuNPs bumps. Shear tests were conducted to characterize the bonding strength. High-throughput 20 μm pitch copper-to-copper direct bonding enables lower annealing temperatures for bulk-Cu to bulk-Cu bonding. Lithographic stencil printing is used to transfer the CuNPs paste, followed by sintering of the nanoparticles to establish interconnections. Shear tests and cross-section SEM were conducted to characterize the bonding strength and quality.

AB - This report demonstrates an innovative method to achieve large scale 20 μm pitch Cu-Cu direct bonding, utilizing lithographic stencil printing to transfer small-sized nano-copper (CuNPs) paste and employs a thermocompression method for CuNPs sintering to establish interconnections between copper-pillars and CuNPs bumps. Shear tests were conducted to characterize the bonding strength. High-throughput 20 μm pitch copper-to-copper direct bonding enables lower annealing temperatures for bulk-Cu to bulk-Cu bonding. Lithographic stencil printing is used to transfer the CuNPs paste, followed by sintering of the nanoparticles to establish interconnections. Shear tests and cross-section SEM were conducted to characterize the bonding strength and quality.

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PB - IEEE

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ER -

20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering

Abstract

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Keywords

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