@inproceedings{35e8b2a0421042c89b2bbdaca2977cd4,
title = "3D Integration Technology for Quantum Computer based on Diamond Spin Qubits",
abstract = "Quantum computer chip based on spin qubits in diamond uses modules that are entangled with on-chip optical links. This enables an increased connectivity and a negligible crosstalk and error-rate when the number of qubits increases on-chip. Here, 3D integration is the key enabling technology for a large-scale integration of the diamond spin qubits with photonic circuits and CMOS electronics for routing, control and readout of qubits. Several engineering challenges exist in order to integrate the large number of spins in diamond with the on-chip circuits operating at a cryogenic temperature. We will review trends, address challenges and discuss future outlook of the integration technology for realization of a scalable quantum computer based on diamond spin qubits. ",
author = "R. Ishihara and J. Hermias and S. Yu and Yu, {K. Y.} and S. Nur and T. Iwai and T. Miyatake and K. Kawaguchi and Y. Doi and S. Sato and Y. LI",
year = "2021",
doi = "10.1109/IEDM19574.2021.9720552",
language = "English",
series = "Technical Digest - International Electron Devices Meeting, IEDM",
publisher = "IEEE",
pages = "14.5.1--14.5.4",
booktitle = "2021 IEEE International Electron Devices Meeting, IEDM 2021",
address = "United States",
note = "2021 IEEE International Electron Devices Meeting, IEDM 2021 ; Conference date: 11-12-2021 Through 16-12-2021",
}