3D Integration Technology for Quantum Computer based on Diamond Spin Qubits

R. Ishihara*, J. Hermias, S. Yu, K. Y. Yu, S. Nur, T. Iwai, T. Miyatake, K. Kawaguchi, Y. Doi, S. Sato, Y. LI

*Corresponding author for this work

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

1 Citation (Scopus)

Abstract

Quantum computer chip based on spin qubits in diamond uses modules that are entangled with on-chip optical links. This enables an increased connectivity and a negligible crosstalk and error-rate when the number of qubits increases on-chip. Here, 3D integration is the key enabling technology for a large-scale integration of the diamond spin qubits with photonic circuits and CMOS electronics for routing, control and readout of qubits. Several engineering challenges exist in order to integrate the large number of spins in diamond with the on-chip circuits operating at a cryogenic temperature. We will review trends, address challenges and discuss future outlook of the integration technology for realization of a scalable quantum computer based on diamond spin qubits.

Original languageEnglish
Title of host publication2021 IEEE International Electron Devices Meeting, IEDM 2021
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages14.5.1-14.5.4
ISBN (Electronic)978-1-6654-2572-8
DOIs
Publication statusPublished - 2021
Event2021 IEEE International Electron Devices Meeting, IEDM 2021 - San Francisco, United States
Duration: 11 Dec 202116 Dec 2021

Publication series

NameTechnical Digest - International Electron Devices Meeting, IEDM
Volume2021-December
ISSN (Print)0163-1918

Conference

Conference2021 IEEE International Electron Devices Meeting, IEDM 2021
Country/TerritoryUnited States
CitySan Francisco
Period11/12/2116/12/21

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