3D Microstructuring of silicon and SU8 polymer for microsystems applications

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	Proc. 19th micromechanics europe (MME 2008)
Editors	U Schnakenberg
Place of Publication	Aachem, Germany
Publisher	Instituut of Materials in Electrical Engineering
Pages	237-241
Number of pages	5
ISBN (Print)	978-3-00-025529-8
Publication status	Published - 2008
Event	19th micromechanics europe (MME 2008), Aachem, Germany - Aachem, Germany Duration: 28 Sept 2008 → 30 Sept 2008

Name
Publisher	Instituut of Materials in Electrical Engineering

Conference	19th micromechanics europe (MME 2008), Aachem, Germany
Period	28/09/08 → 30/09/08

Keywords

@inproceedings{d1dc5f7b4e3349f1a59046a05f2d2667,

title = "3D Microstructuring of silicon and SU8 polymer for microsystems applications",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "PM Sarro and J Wei and {Chu Duc}, T",

year = "2008",

language = "Undefined/Unknown",

isbn = "978-3-00-025529-8",

publisher = "Instituut of Materials in Electrical Engineering",

pages = "237--241",

editor = "U Schnakenberg",

booktitle = "Proc. 19th micromechanics europe (MME 2008)",

note = "19th micromechanics europe (MME 2008), Aachem, Germany ; Conference date: 28-09-2008 Through 30-09-2008",

}

3D Microstructuring of silicon and SU8 polymer for microsystems applications. / Sarro, PM ; Wei, J; Chu Duc, T.
Proc. 19th micromechanics europe (MME 2008). ed. / U Schnakenberg. Aachem, Germany: Instituut of Materials in Electrical Engineering, 2008. p. 237-241.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - 3D Microstructuring of silicon and SU8 polymer for microsystems applications

AU - Sarro, PM

AU - Wei, J

AU - Chu Duc, T

PY - 2008

Y1 - 2008

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 978-3-00-025529-8

SP - 237

EP - 241

BT - Proc. 19th micromechanics europe (MME 2008)

A2 - Schnakenberg, U

PB - Instituut of Materials in Electrical Engineering

CY - Aachem, Germany

T2 - 19th micromechanics europe (MME 2008), Aachem, Germany

Y2 - 28 September 2008 through 30 September 2008

ER -