3D Printed Electronics: Opportunities and Challenges from case studies

Yu Song, Roy Boekraad, Lampros Roussos, Adrie Kooijman, Charlie Wang, Jo Geraedts

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

1 Citation (Scopus)

Abstract

3D printed electronics introduces new opportunities in product design. On the other side, it also brings challenges regarding many aspects in the design and manufacturing process of prototypes/products. In this paper, based on our preliminary investigations, we summarize the opportunities of using 3D printed electronics in product design as: 1) it offers designers more freedom in their designs; 2) it promotes miniaturization of design; 3) it accelerates the design and manufacturing process; 4) it is able to improve the efficiency of producing customized/personalized mechatronic/electronic products and 5) it improves the sustainability in the product design and manufacturing process. Motivated by those opportunities, we conducted four case studies regarding four key aspects of 3D printed electronics: the conductive materials, geometric modelling, multiphysics simulation and manufacturing tools. Based on the findings in those case studies, we identified the challenges in 3D printed electronics and highlight the future works which may provide a better support to the needs of product designers.
Original languageEnglish
Title of host publicationProceedings of ASME 2017 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference IDETC/CIE 2017
Subtitle of host publication37th Computers and Information in Engineering Conference
PublisherAmerican Society of Mechanical Engineers
Pages1-11
Number of pages11
Volume1
ISBN (Print)978-0-7918-5811-0
DOIs
Publication statusPublished - 2017
EventASME 2017 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference: IDETC/CIE 2017 - Cleveland, United States
Duration: 6 Aug 20179 Aug 2017

Conference

ConferenceASME 2017 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference
CountryUnited States
CityCleveland
Period6/08/179/08/17

Keywords

  • 3D printed electronics
  • 3D printing
  • CAD
  • simulation

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  • Cite this

    Song, Y., Boekraad, R., Roussos, L., Kooijman, A., Wang, C., & Geraedts, J. (2017). 3D Printed Electronics: Opportunities and Challenges from case studies. In Proceedings of ASME 2017 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference IDETC/CIE 2017: 37th Computers and Information in Engineering Conference (Vol. 1, pp. 1-11). [DETC2017-67503] American Society of Mechanical Engineers. https://doi.org/10.1115/DETC2017-67503