3D system-in-package design using stacked silicon submount technology

M Dong, F Santagata, R Sokolovskij, J Wei, C Yuan, GQ Zhang

Research output: Contribution to journalArticleScientificpeer-review

7 Citations (Scopus)
Original languageEnglish
Pages (from-to)63-72
Number of pages10
JournalMicroelectronics International: an international journal
Volume32
Issue number2
DOIs
Publication statusPublished - 2015

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