3D-TSV: The 3D trajectory-based stress visualizer

Junpeng Wang, Christoph Neuhauser, J. Wu, Xifeng Gao, Rüdiger Westermann

Research output: Contribution to journalArticleScientificpeer-review

96 Downloads (Pure)


In this paper, we present novel algorithms for visualizing the three mutually orthogonal principal stress directions in 3D solids under load and we discuss the efficient integration of these algorithms into the 3D Trajectory-based Stress Visualizer (3D-TSV), a visual analysis tool for the exploration of the principal stress directions of 3D stress field. In the design of 3D-TSV, several perceptual problems have been solved. We present a novel algorithm for generating a space-filling and evenly spaced set of stress lines. The algorithm obtains a more
regular appearance by considering the locations of lines, and enables the extraction of a level-of-detail representation with adjustable sparseness of the trajectories along a certain stress direction. A new combined visualization of two principal directions via oriented ribbons enables to convey ambiguities in the orientation of the principal stress directions. Additional depth cues have been added to improve the perception of the spatial relationships between trajectories. 3D-TSV provides a modular and generic implementation of key algorithms required for a trajectory-based visual analysis of principal stress directions, including the automatic seeding of space-filling stress lines, their extraction using numerical schemes, their mapping to an effective renderable
representation, and rendering options to convey structures with special mechanical properties. 3D-TSV is accessible to end users via a C++- and OpenGL-based rendering frontend that is seamlessly connected to a
MatLab-based extraction backend. The code (BSD license) of 3D-TSV as well as scripts to make ANSYS and ABAQUS simulation results accessible to the 3D-TSV backend are publicly available.
Original languageEnglish
Article number103144
Number of pages11
JournalAdvances in Engineering Software: including computing systems in engineering
Publication statusPublished - 2022


Dive into the research topics of '3D-TSV: The 3D trajectory-based stress visualizer'. Together they form a unique fingerprint.

Cite this