Abstract
High-performance IC-to-antenna interconnection is one of the key enablers for the mass production of high-end millimeter wave (mmW) radar systems above 100 GHz. In this work, a radar system with an on-package antenna array working at 122 GHz is presented. The antenna is placed on top of the molded package and the antenna-to-chip interconnection is realized by through-polymer via (TPV) technology. The detailed fabrication process of the radar antenna-in-package (AiP) with TPV is discussed. The results from the functional tests of the radar AiP are presented and benchmarked to a commercial quad-flat no-leads (QFN) package with an open antenna cavity. The detection margin between the echo signal and the constant false alarm rate (CFAR) threshold is approximately 10 dB higher for the TPV radar AiP compared with the benchmarked commercial QFN package.
Original language | English |
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Article number | 9795927 |
Pages (from-to) | 893-901 |
Number of pages | 9 |
Journal | IEEE Transactions on Components, Packaging and Manufacturing Technology |
Volume | 12 |
Issue number | 6 |
DOIs | |
Publication status | Published - 2022 |
Bibliographical note
Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-careOtherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
Keywords
- 0.13-µm silicon germanium bipolar complementary metal-oxide semiconductor (SiGe BiCMOS)
- film-assisted molding
- metalized polymer
- monostatic frequency modulated continuous-wave (FMCW) radar
- patch antennas
- radar antenna-in-package (AiP)
- SU-8
- system-in-package (SiP)
- through-polymer via (TPV)