A 0.12mm2 Wien-Bridge Temperature Sensor with 0.1°C (3σ) Inaccuracy from -40°C to 180°C

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

7 Citations (Scopus)

Abstract

Resistor-based temperature sensors can achieve much higher resolution and energy efficiency than conventional BJT-based sensors [1], but they typically occupy more area (> 0.25 mm 2 ) and have lower operating temperatures (le 125 {circ} {C}) [2]-[4]. This work describes a 0.12mm 2 resistor-based sensor that uses a Wien-bridge (WB) filter to achieve 0.1 {circ} {C} (3 sigma) inaccuracy from - 40 {circ} {C} to 180 {circ} {C}. Compared to a state-of-the-art WB sensor [4], it occupies 6 × less area and achieves comparable relative accuracy over a 76% wider operating range.

Original languageEnglish
Title of host publication2019 IEEE International Solid-State Circuits Conference, ISSCC 2019
EditorsJan van der Spiegel
Place of PublicationPiscataway, NJ
PublisherIEEE
Pages184-186
Number of pages3
Volume2019-February
ISBN (Electronic)978-1-5386-8531-0
ISBN (Print)978-1-5386-8532-7
DOIs
Publication statusPublished - 2019
EventISSCC 2019: IEEE International Solid-State Circuits Conference - San Francisco, CA, United States
Duration: 17 Feb 201921 Feb 2019

Conference

ConferenceISSCC 2019
CountryUnited States
CitySan Francisco, CA
Period17/02/1921/02/19

Keywords

  • Temperature sensors
  • Resistors
  • Temperature measurement
  • Packaging
  • 1/f noise
  • Ceramics
  • Plastics

Fingerprint Dive into the research topics of 'A 0.12mm<sup>2</sup> Wien-Bridge Temperature Sensor with 0.1°C (3σ) Inaccuracy from -40°C to 180°C'. Together they form a unique fingerprint.

  • Cite this

    Pan, S., Gürleyük, Ç., Pimenta, M. F., & Makinwa, K. A. A. (2019). A 0.12mm2 Wien-Bridge Temperature Sensor with 0.1°C (3σ) Inaccuracy from -40°C to 180°C. In J. van der Spiegel (Ed.), 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019 (Vol. 2019-February, pp. 184-186). [8662457] IEEE. https://doi.org/10.1109/ISSCC.2019.8662457