A 0.91mW/Element Pitch-Matched Front-End ASIC with Integrated Subarray Beamforming ADC for Miniature 3D Ultrasound Probes

Chao Chen, Zhao Chen, Deep Bera, Emile Noothout, Zu-Yao Chang, Mingliang Tan, Hendrik J. Vos, Johan G. Bosch, Martin D. Verweij, Nico de Jong, Michiel A. P. Pertijs

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

10 Citations (Scopus)


Data acquisition from 2D transducer arrays is one of the main challenges for the development of emerging miniature 3D ultrasound imaging devices, such as 3D trans-esophageal (TEE) and intra-cardiac echocardiography (ICE) probes (Fig. 10.5.1). The main obstacle lies in the mismatch between the large number of transducer elements (103 to 104) and the limited cable count (<;200). Recent advances in transducer-on-CMOS integration have enabled the use of in-probe subarray beamforming based on delay-and-sum (DAS) circuits [1] to reduce the channel count by an order of magnitude. Further reduction calls for in-probe digitization to enable more advanced data processing and compression in the digital domain. However, prior designs [2-4] compromise on transducer pitch (> half wavelength) to accommodate the ADC and consume >9mW/element, which translates into unacceptable self-heating in miniature 3D probes.
Original languageEnglish
Title of host publication2018 IEEE International Solid-State Circuits Conference, ISSCC 2018
Subtitle of host publicationDigest of Technical Papers
EditorsLaura C. Fujino
Place of PublicationLewiston
Number of pages3
ISBN (Electronic)978-1-5090-4940-0
ISBN (Print)978-1-5386-2227-8
Publication statusPublished - 2018
Event65th IEEE International Solid-State Circuits Conference, ISSCC 2018 - San Francisco, United States
Duration: 11 Feb 201815 Feb 2018

Publication series

NameIEEE International Solid State Circuits Conference. Digest of Technical Papers
PublisherInstitute of Electrical and Electronics Engineers
ISSN (Print)0193-6530


Conference65th IEEE International Solid-State Circuits Conference, ISSCC 2018
CountryUnited States
CitySan Francisco


  • Transducers
  • Array signal processing
  • Ultrasonic imaging
  • Probes
  • Three-dimensional displays
  • Clocks
  • Imaging

Cite this