A 0.91mW/Element Pitch-Matched Front-End ASIC with Integrated Subarray Beamforming ADC for Miniature 3D Ultrasound Probes

Chao Chen; Zhao Chen; Deep Bera; Emile Noothout; Zu-Yao Chang; Mingliang Tan; Hendrik J. Vos; Johan G. Bosch; Martin D. Verweij; Nico de Jong; Michiel A. P. Pertijs

doi:10.1109/ISSCC.2018.8310246

A 0.91mW/Element Pitch-Matched Front-End ASIC with Integrated Subarray Beamforming ADC for Miniature 3D Ultrasound Probes

Chao Chen, Zhao Chen, Deep Bera, Emile Noothout, Zu-Yao Chang, Mingliang Tan, Hendrik J. Vos, Johan G. Bosch, Martin D. Verweij, Nico de Jong, Michiel A. P. Pertijs

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

17 Citations (Scopus)

Abstract

Data acquisition from 2D transducer arrays is one of the main challenges for the development of emerging miniature 3D ultrasound imaging devices, such as 3D trans-esophageal (TEE) and intra-cardiac echocardiography (ICE) probes (Fig. 10.5.1). The main obstacle lies in the mismatch between the large number of transducer elements (103 to 104) and the limited cable count (<;200). Recent advances in transducer-on-CMOS integration have enabled the use of in-probe subarray beamforming based on delay-and-sum (DAS) circuits [1] to reduce the channel count by an order of magnitude. Further reduction calls for in-probe digitization to enable more advanced data processing and compression in the digital domain. However, prior designs [2-4] compromise on transducer pitch (> half wavelength) to accommodate the ADC and consume >9mW/element, which translates into unacceptable self-heating in miniature 3D probes.

Original language	English
Title of host publication	2018 IEEE International Solid-State Circuits Conference, ISSCC 2018
Subtitle of host publication	Digest of Technical Papers
Editors	Laura C. Fujino
Place of Publication	Lewiston
Publisher	IEEE
Pages	186-188
Number of pages	3
ISBN (Electronic)	978-1-5090-4940-0
ISBN (Print)	978-1-5386-2227-8
DOIs	https://doi.org/10.1109/ISSCC.2018.8310246
Publication status	Published - 2018
Event	65th IEEE International Solid-State Circuits Conference, ISSCC 2018 - San Francisco, United States Duration: 11 Feb 2018 → 15 Feb 2018

Publication series

Name	IEEE International Solid State Circuits Conference. Digest of Technical Papers
Publisher	Institute of Electrical and Electronics Engineers
Volume	61
ISSN (Print)	0193-6530

Conference

Conference	65th IEEE International Solid-State Circuits Conference, ISSCC 2018
Country/Territory	United States
City	San Francisco
Period	11/02/18 → 15/02/18

Keywords

Transducers
Array signal processing
Ultrasonic imaging
Probes
Three-dimensional displays
Clocks
Imaging

Access to Document

10.1109/ISSCC.2018.8310246

Cite this

Chen, C., Chen, Z., Bera, D., Noothout, E., Chang, Z.-Y., Tan, M., Vos, H. J., Bosch, J. G., Verweij, M. D., de Jong, N., & Pertijs, M. A. P. (2018). A 0.91mW/Element Pitch-Matched Front-End ASIC with Integrated Subarray Beamforming ADC for Miniature 3D Ultrasound Probes. In L. C. Fujino (Ed.), 2018 IEEE International Solid-State Circuits Conference, ISSCC 2018: Digest of Technical Papers (pp. 186-188). (IEEE International Solid State Circuits Conference. Digest of Technical Papers; Vol. 61). IEEE. https://doi.org/10.1109/ISSCC.2018.8310246

Chen, Chao ; Chen, Zhao ; Bera, Deep et al. / A 0.91mW/Element Pitch-Matched Front-End ASIC with Integrated Subarray Beamforming ADC for Miniature 3D Ultrasound Probes. 2018 IEEE International Solid-State Circuits Conference, ISSCC 2018: Digest of Technical Papers. editor / Laura C. Fujino. Lewiston : IEEE, 2018. pp. 186-188 (IEEE International Solid State Circuits Conference. Digest of Technical Papers).

@inproceedings{98776cf4cd244deb86f08ac2c7b21120,

title = "A 0.91mW/Element Pitch-Matched Front-End ASIC with Integrated Subarray Beamforming ADC for Miniature 3D Ultrasound Probes",

abstract = "Data acquisition from 2D transducer arrays is one of the main challenges for the development of emerging miniature 3D ultrasound imaging devices, such as 3D trans-esophageal (TEE) and intra-cardiac echocardiography (ICE) probes (Fig. 10.5.1). The main obstacle lies in the mismatch between the large number of transducer elements (103 to 104) and the limited cable count (<;200). Recent advances in transducer-on-CMOS integration have enabled the use of in-probe subarray beamforming based on delay-and-sum (DAS) circuits [1] to reduce the channel count by an order of magnitude. Further reduction calls for in-probe digitization to enable more advanced data processing and compression in the digital domain. However, prior designs [2-4] compromise on transducer pitch (> half wavelength) to accommodate the ADC and consume >9mW/element, which translates into unacceptable self-heating in miniature 3D probes.",

keywords = "Transducers, Array signal processing, Ultrasonic imaging, Probes, Three-dimensional displays, Clocks, Imaging",

author = "Chao Chen and Zhao Chen and Deep Bera and Emile Noothout and Zu-Yao Chang and Mingliang Tan and Vos, {Hendrik J.} and Bosch, {Johan G.} and Verweij, {Martin D.} and {de Jong}, Nico and Pertijs, {Michiel A. P.}",

year = "2018",

doi = "10.1109/ISSCC.2018.8310246",

language = "English",

isbn = "978-1-5386-2227-8",

series = "IEEE International Solid State Circuits Conference. Digest of Technical Papers",

publisher = "IEEE",

pages = "186--188",

editor = "Fujino, {Laura C.}",

booktitle = "2018 IEEE International Solid-State Circuits Conference, ISSCC 2018",

address = "United States",

note = "65th IEEE International Solid-State Circuits Conference, ISSCC 2018 ; Conference date: 11-02-2018 Through 15-02-2018",

}

Chen, C, Chen, Z, Bera, D, Noothout, E , Chang, Z-Y, Tan, M, Vos, HJ, Bosch, JG, Verweij, MD , de Jong, N & Pertijs, MAP 2018, A 0.91mW/Element Pitch-Matched Front-End ASIC with Integrated Subarray Beamforming ADC for Miniature 3D Ultrasound Probes. in LC Fujino (ed.), 2018 IEEE International Solid-State Circuits Conference, ISSCC 2018: Digest of Technical Papers. IEEE International Solid State Circuits Conference. Digest of Technical Papers, vol. 61, IEEE, Lewiston, pp. 186-188, 65th IEEE International Solid-State Circuits Conference, ISSCC 2018, San Francisco, United States, 11/02/18. https://doi.org/10.1109/ISSCC.2018.8310246

A 0.91mW/Element Pitch-Matched Front-End ASIC with Integrated Subarray Beamforming ADC for Miniature 3D Ultrasound Probes. / Chen, Chao; Chen, Zhao; Bera, Deep et al.
2018 IEEE International Solid-State Circuits Conference, ISSCC 2018: Digest of Technical Papers. ed. / Laura C. Fujino. Lewiston: IEEE, 2018. p. 186-188 (IEEE International Solid State Circuits Conference. Digest of Technical Papers; Vol. 61).

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - A 0.91mW/Element Pitch-Matched Front-End ASIC with Integrated Subarray Beamforming ADC for Miniature 3D Ultrasound Probes

AU - Chen, Chao

AU - Chen, Zhao

AU - Bera, Deep

AU - Noothout, Emile

AU - Chang, Zu-Yao

AU - Tan, Mingliang

AU - Vos, Hendrik J.

AU - Bosch, Johan G.

AU - Verweij, Martin D.

AU - de Jong, Nico

AU - Pertijs, Michiel A. P.

PY - 2018

Y1 - 2018

N2 - Data acquisition from 2D transducer arrays is one of the main challenges for the development of emerging miniature 3D ultrasound imaging devices, such as 3D trans-esophageal (TEE) and intra-cardiac echocardiography (ICE) probes (Fig. 10.5.1). The main obstacle lies in the mismatch between the large number of transducer elements (103 to 104) and the limited cable count (<;200). Recent advances in transducer-on-CMOS integration have enabled the use of in-probe subarray beamforming based on delay-and-sum (DAS) circuits [1] to reduce the channel count by an order of magnitude. Further reduction calls for in-probe digitization to enable more advanced data processing and compression in the digital domain. However, prior designs [2-4] compromise on transducer pitch (> half wavelength) to accommodate the ADC and consume >9mW/element, which translates into unacceptable self-heating in miniature 3D probes.

AB - Data acquisition from 2D transducer arrays is one of the main challenges for the development of emerging miniature 3D ultrasound imaging devices, such as 3D trans-esophageal (TEE) and intra-cardiac echocardiography (ICE) probes (Fig. 10.5.1). The main obstacle lies in the mismatch between the large number of transducer elements (103 to 104) and the limited cable count (<;200). Recent advances in transducer-on-CMOS integration have enabled the use of in-probe subarray beamforming based on delay-and-sum (DAS) circuits [1] to reduce the channel count by an order of magnitude. Further reduction calls for in-probe digitization to enable more advanced data processing and compression in the digital domain. However, prior designs [2-4] compromise on transducer pitch (> half wavelength) to accommodate the ADC and consume >9mW/element, which translates into unacceptable self-heating in miniature 3D probes.

KW - Transducers

KW - Array signal processing

KW - Ultrasonic imaging

KW - Probes

KW - Three-dimensional displays

KW - Clocks

KW - Imaging

U2 - 10.1109/ISSCC.2018.8310246

DO - 10.1109/ISSCC.2018.8310246

M3 - Conference contribution

SN - 978-1-5386-2227-8

T3 - IEEE International Solid State Circuits Conference. Digest of Technical Papers

SP - 186

EP - 188

BT - 2018 IEEE International Solid-State Circuits Conference, ISSCC 2018

A2 - Fujino, Laura C.

PB - IEEE

CY - Lewiston

T2 - 65th IEEE International Solid-State Circuits Conference, ISSCC 2018

Y2 - 11 February 2018 through 15 February 2018

ER -

Chen C, Chen Z, Bera D, Noothout E , Chang ZY, Tan M et al. A 0.91mW/Element Pitch-Matched Front-End ASIC with Integrated Subarray Beamforming ADC for Miniature 3D Ultrasound Probes. In Fujino LC, editor, 2018 IEEE International Solid-State Circuits Conference, ISSCC 2018: Digest of Technical Papers. Lewiston: IEEE. 2018. p. 186-188. (IEEE International Solid State Circuits Conference. Digest of Technical Papers). doi: 10.1109/ISSCC.2018.8310246

A 0.91mW/Element Pitch-Matched Front-End ASIC with Integrated Subarray Beamforming ADC for Miniature 3D Ultrasound Probes

Abstract

Publication series

Conference

Keywords

Access to Document

Fingerprint

Cite this