A 0.91mW/Element Pitch-Matched Front-End ASIC with Integrated Subarray Beamforming ADC for Miniature 3D Ultrasound Probes

Chao Chen, Zhao Chen, Deep Bera, Emile Noothout, Zu-Yao Chang, Mingliang Tan, Hendrik J. Vos, Johan G. Bosch, Martin D. Verweij, Nico de Jong, Michiel A. P. Pertijs

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

10 Citations (Scopus)

Abstract

Data acquisition from 2D transducer arrays is one of the main challenges for the development of emerging miniature 3D ultrasound imaging devices, such as 3D trans-esophageal (TEE) and intra-cardiac echocardiography (ICE) probes (Fig. 10.5.1). The main obstacle lies in the mismatch between the large number of transducer elements (103 to 104) and the limited cable count (<;200). Recent advances in transducer-on-CMOS integration have enabled the use of in-probe subarray beamforming based on delay-and-sum (DAS) circuits [1] to reduce the channel count by an order of magnitude. Further reduction calls for in-probe digitization to enable more advanced data processing and compression in the digital domain. However, prior designs [2-4] compromise on transducer pitch (> half wavelength) to accommodate the ADC and consume >9mW/element, which translates into unacceptable self-heating in miniature 3D probes.
Original languageEnglish
Title of host publication2018 IEEE International Solid-State Circuits Conference, ISSCC 2018
Subtitle of host publicationDigest of Technical Papers
EditorsLaura C. Fujino
Place of PublicationLewiston
PublisherIEEE
Pages186-188
Number of pages3
ISBN (Electronic)978-1-5090-4940-0
ISBN (Print)978-1-5386-2227-8
DOIs
Publication statusPublished - 2018
Event65th IEEE International Solid-State Circuits Conference, ISSCC 2018 - San Francisco, United States
Duration: 11 Feb 201815 Feb 2018

Publication series

NameIEEE International Solid State Circuits Conference. Digest of Technical Papers
PublisherInstitute of Electrical and Electronics Engineers
Volume61
ISSN (Print)0193-6530

Conference

Conference65th IEEE International Solid-State Circuits Conference, ISSCC 2018
CountryUnited States
CitySan Francisco
Period11/02/1815/02/18

Keywords

  • Transducers
  • Array signal processing
  • Ultrasonic imaging
  • Probes
  • Three-dimensional displays
  • Clocks
  • Imaging

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