A 1.2mW/channel 100m-Pitch-Matched Transceiver ASIC with Boxcar-Integration-Based RX Micro-Beamformer for High-Resolution 3D Ultrasound Imaging

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The integration of 2D ultrasonic transducer arrays and pitch-matched ASICs has enabled the realization of various 3D ultrasound imaging devices in recent years [1]-[3]. As applications such as 3D intravascular ultrasonography, intra-cardiac echocardiography, and trans-fontanelle ultrasonography call for miniaturization and improved spatial resolution, higher-frequency transducers (>5MHz) with a correspondingly smaller array pitch (<150m) are needed. Such devices generally employ a large number of transducer elements, calling for channel-count reduction in the ASIC while meeting stringent restrictions on per-element power consumption and die area. Micro-beamforming (BF) is an effective way of reducing channel count by performing a delay-and-sum operation on the echo signals received within a sub-array [1]. However, prior BF implementations employ per-element capacitive memory to realize the delay [1], [2], making it increasingly difficult to apply BF in smaller-pitch arrays.

Original languageEnglish
Title of host publication2022 IEEE International Solid-State Circuits Conference, ISSCC 2022
Subtitle of host publicationDigest of technical papers
EditorsLaura C. Fujino
Place of PublicationDanvers
Number of pages3
ISBN (Electronic)978-1-6654-2800-2
ISBN (Print)978-1-6654-2801-9
Publication statusPublished - 2022
Event2022 IEEE International Solid- State Circuits Conference (ISSCC) - Online at San Francisco, United States
Duration: 20 Feb 202226 Feb 2022

Publication series

NameDigest of Technical Papers - IEEE International Solid-State Circuits Conference
ISSN (Print)0193-6530


Conference2022 IEEE International Solid- State Circuits Conference (ISSCC)
Abbreviated titleISSCC 2022
Country/TerritoryUnited States
CityOnline at San Francisco

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