Abstract
Systems-on-chip traditionally rely on bulky quartz crystals to comply with wired communication standards like CAN or USB 2.0. Integrated frequency references with better than 500ppm inaccuracy could meet this need, resulting in higher integration and lower cost. Candidate architectures have employed RC-, LC- or TD (thermal diffusivity)-based time constants, all of which can be realized in standard CMOS. Compared to LC (sim 20mathrm{mW}, sim 100mathrm{ppm}) [1] or TD (sim 2mathrm{mW},sim 1000mathrm{ppm}) [2] references, RC references offer the lowest power consumption and competitive accuracy (< 1mathrm{mW}, 200mathrm{ppm})[3]. However, due to the nonlinear temperature dependence of on-chip resistors, such references require complex temperature-compensation schemes based on higher-order correction polynomials and extensive calibration [3], [4], or complicated analog compensation networks [5].
Original language | English |
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Title of host publication | 2020 IEEE International Solid-State Circuits Conference, ISSCC 2020 |
Publisher | IEEE |
Pages | 64-66 |
Number of pages | 3 |
ISBN (Electronic) | 978-1-7281-3205-1 |
ISBN (Print) | 978-1-7281-3206-8 |
DOIs | |
Publication status | Published - 2020 |
Event | 2020 IEEE International Solid-State Circuits Conference, ISSCC 2020 - San Francisco, United States Duration: 16 Feb 2020 → 20 Feb 2020 |
Conference
Conference | 2020 IEEE International Solid-State Circuits Conference, ISSCC 2020 |
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Country/Territory | United States |
City | San Francisco |
Period | 16/02/20 → 20/02/20 |
Bibliographical note
Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-careOtherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.