A 45° saw-dicing process applied to a glass substrate for wafer-level optical splitter fabrication for optical coherence tomography

M.J. Maciel, C.G. Costa, M.F. Silva, S.B. Gonçalves, A.C. Peixoto, A.F Ribeiro, R.F. Wolffenbuttel, J.H. Correia

Research output: Contribution to journalArticleScientificpeer-review

1 Citation (Scopus)

Abstract

This paper reports on the development of a technology for the wafer-level fabrication of an optical Michelson interferometer, which is an essential component in a micro opto-electromechanical system (MOEMS) for a miniaturized optical coherence tomography (OCT) system. The MOEMS consists on a titanium dioxide/silicon dioxide dielectric beam splitter and chromium/gold micro-mirrors. These optical components are deposited on 45° tilted surfaces to allow the horizontal/vertical separation of the incident beam in the final micro-integrated system. The fabrication process consists of 45° saw dicing of a glass substrate and the subsequent deposition of dielectric multilayers and metal layers. The 45° saw dicing is fully characterized in this paper, which also includes an analysis of the roughness. The optimum process results in surfaces with a roughness of 19.76 nm (rms). The actual saw dicing process for a high-quality final surface results as a compromise between the dicing blade's grit size (#1200) and the cutting speed (0.3 mm s−1). The proposed wafer-level fabrication allows rapid and low-cost processing, high compactness and the possibility of wafer-level alignment/assembly with other optical micro components for OCT integrated imaging.
Original languageEnglish
Pages (from-to)1-8
Number of pages8
JournalJournal of Micromechanics and Microengineering
Volume26
Issue number8
DOIs
Publication statusPublished - 22 Jul 2016

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