A BJT-based temperature sensor with a packaging-robust inaccuracy of ±0.3°C (3s) from -55°C to +125°C after heater-assisted voltage calibration

Bahman Yousefzadeh; Kofi A.A. Makinwa

doi:10.1109/ISSCC.2017.7870311

A BJT-based temperature sensor with a packaging-robust inaccuracy of ±0.3°C (3s) from -55°C to +125°C after heater-assisted voltage calibration

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

24 Citations (Scopus)

Abstract

This paper presents a BJT-based temperature sensor, which can be accurately trimmed in both ceramic and plastic packages, on the basis of purely electrical measurements at room temperature. This is achieved by combining the voltage-calibration technique from [1] with an on-chip heater, which can heat the sensing BJTs from room temperature to ∼85°C in 0.5s. Measurements show that the sensor can then be trimmed to an inaccuracy of ±0.3°C (3σ) over the military range (-55 to +125°C). This is similar to the inaccuracy obtained after conventional temperature calibration, i.e., at well-defined temperatures, but requires much less calibration time and infrastructure.

Original language	English
Title of host publication	2017 IEEE International Solid-State Circuits Conference, ISSCC 2017
Subtitle of host publication	Digest of Technical Papers
Editors	Laura C. Fujino
Place of Publication	Danvers, MA
Publisher	IEEE
Pages	162-163
Number of pages	2
Volume	60
ISBN (Electronic)	978-1-5090-3758-2
ISBN (Print)	978-1-5090-3757-5
DOIs	https://doi.org/10.1109/ISSCC.2017.7870311
Publication status	Published - 2017
Event	ISSCC 2017: 64th IEEE International Solid-State Circuits Conference - San Francisco, CA, United States Duration: 5 Feb 2017 → 9 Feb 2017

Conference

Conference	ISSCC 2017
Country/Territory	United States
City	San Francisco, CA
Period	5/02/17 → 9/02/17

Keywords

Temperature measurement
Calibration
Temperature sensors
Heating
Fitting
Current measurement

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10.1109/ISSCC.2017.7870311

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Yousefzadeh, B., & Makinwa, K. A. A. (2017). A BJT-based temperature sensor with a packaging-robust inaccuracy of ±0.3°C (3s) from -55°C to +125°C after heater-assisted voltage calibration. In L. C. Fujino (Ed.), 2017 IEEE International Solid-State Circuits Conference, ISSCC 2017: Digest of Technical Papers (Vol. 60, pp. 162-163). Article 7870311 IEEE. https://doi.org/10.1109/ISSCC.2017.7870311

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abstract = "This paper presents a BJT-based temperature sensor, which can be accurately trimmed in both ceramic and plastic packages, on the basis of purely electrical measurements at room temperature. This is achieved by combining the voltage-calibration technique from [1] with an on-chip heater, which can heat the sensing BJTs from room temperature to ∼85°C in 0.5s. Measurements show that the sensor can then be trimmed to an inaccuracy of ±0.3°C (3σ) over the military range (-55 to +125°C). This is similar to the inaccuracy obtained after conventional temperature calibration, i.e., at well-defined temperatures, but requires much less calibration time and infrastructure.",

keywords = "Temperature measurement, Calibration, Temperature sensors, Heating, Fitting, Current measurement",

author = "Bahman Yousefzadeh and Makinwa, {Kofi A.A.}",

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booktitle = "2017 IEEE International Solid-State Circuits Conference, ISSCC 2017",

publisher = "IEEE",

address = "United States",

note = "ISSCC 2017 : 64th IEEE International Solid-State Circuits Conference ; Conference date: 05-02-2017 Through 09-02-2017",

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Yousefzadeh, B & Makinwa, KAA 2017, A BJT-based temperature sensor with a packaging-robust inaccuracy of ±0.3°C (3s) from -55°C to +125°C after heater-assisted voltage calibration. in LC Fujino (ed.), 2017 IEEE International Solid-State Circuits Conference, ISSCC 2017: Digest of Technical Papers. vol. 60, 7870311, IEEE, Danvers, MA, pp. 162-163, ISSCC 2017, San Francisco, CA, United States, 5/02/17. https://doi.org/10.1109/ISSCC.2017.7870311

A BJT-based temperature sensor with a packaging-robust inaccuracy of ±0.3°C (3s) from -55°C to +125°C after heater-assisted voltage calibration. / Yousefzadeh, Bahman; Makinwa, Kofi A.A.
2017 IEEE International Solid-State Circuits Conference, ISSCC 2017: Digest of Technical Papers. ed. / Laura C. Fujino. Vol. 60 Danvers, MA: IEEE, 2017. p. 162-163 7870311.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

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AB - This paper presents a BJT-based temperature sensor, which can be accurately trimmed in both ceramic and plastic packages, on the basis of purely electrical measurements at room temperature. This is achieved by combining the voltage-calibration technique from [1] with an on-chip heater, which can heat the sensing BJTs from room temperature to ∼85°C in 0.5s. Measurements show that the sensor can then be trimmed to an inaccuracy of ±0.3°C (3σ) over the military range (-55 to +125°C). This is similar to the inaccuracy obtained after conventional temperature calibration, i.e., at well-defined temperatures, but requires much less calibration time and infrastructure.

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KW - Heating

KW - Fitting

KW - Current measurement

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Yousefzadeh B, Makinwa KAA. A BJT-based temperature sensor with a packaging-robust inaccuracy of ±0.3°C (3s) from -55°C to +125°C after heater-assisted voltage calibration. In Fujino LC, editor, 2017 IEEE International Solid-State Circuits Conference, ISSCC 2017: Digest of Technical Papers. Vol. 60. Danvers, MA: IEEE. 2017. p. 162-163. 7870311 doi: 10.1109/ISSCC.2017.7870311

A BJT-based temperature sensor with a packaging-robust inaccuracy of ±0.3°C (3s) from -55°C to +125°C after heater-assisted voltage calibration

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