A BJT-based temperature sensor with a packaging-robust inaccuracy of ±0.3°C (3s) from -55°C to +125°C after heater-assisted voltage calibration

Bahman Yousefzadeh, Kofi A.A. Makinwa

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

11 Citations (Scopus)

Abstract

This paper presents a BJT-based temperature sensor, which can be accurately trimmed in both ceramic and plastic packages, on the basis of purely electrical measurements at room temperature. This is achieved by combining the voltage-calibration technique from [1] with an on-chip heater, which can heat the sensing BJTs from room temperature to ∼85°C in 0.5s. Measurements show that the sensor can then be trimmed to an inaccuracy of ±0.3°C (3σ) over the military range (-55 to +125°C). This is similar to the inaccuracy obtained after conventional temperature calibration, i.e., at well-defined temperatures, but requires much less calibration time and infrastructure.

Original languageEnglish
Title of host publication2017 IEEE International Solid-State Circuits Conference, ISSCC 2017
Subtitle of host publicationDigest of Technical Papers
EditorsLaura C. Fujino
Place of PublicationDanvers, MA
PublisherIEEE
Pages162-163
Number of pages2
Volume60
ISBN (Electronic)978-1-5090-3758-2
ISBN (Print)978-1-5090-3757-5
DOIs
Publication statusPublished - 2017
EventISSCC 2017: 64th IEEE International Solid-State Circuits Conference - San Francisco, CA, United States
Duration: 5 Feb 20179 Feb 2017

Conference

ConferenceISSCC 2017
CountryUnited States
CitySan Francisco, CA
Period5/02/179/02/17

Keywords

  • Temperature measurement
  • Calibration
  • Temperature sensors
  • Heating
  • Fitting
  • Current measurement

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