A Characterization Method for Viscoelastic Bulk Modulus of Molding Compounds

MK Saraswat; KMB Jansen; MD Patel; LJ Ernst; C Bohm; A Kessler; H Preu; M Stecher

A Characterization Method for Viscoelastic Bulk Modulus of Molding Compounds

MK Saraswat, KMB Jansen, MD Patel, LJ Ernst, C Bohm, A Kessler, H Preu, M Stecher

Computational Design and Mechanics

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

Abstract

Reliability calculations of the microelectronic packages require cure dependent viscoelastic constitutive relationship for the packaging polymers in order to predict residual stress and strain fields in the final product. The residual stresses can result in the product failure due to warpage, interfacial delamination, thermal fatigue etc. The previous work in the same group (Ernst et al. 2006, 2003) towards complete viscoelastic model development was done using "approximate fully cure dependent" model in order to predict warpage of the QFN package. The relaxation shear modulus was accurately established but due to measurement limitation only estimated values of bulk modulus could be used. In the present work, a high pressure dilatometer (Gnomix PVT apparatus) was used to establish the time, temperature and pressure dependence of bulk modulus. The bulk modulus shows negligible time dependence which suggests that bulk modulus is not a viscoelastic but merely a temperature dependent linear elastic parameter. A material model for time, temperature and pressure dependency of the bulk Modulus is developed.

Original language	Undefined/Unknown
Title of host publication	Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Editors	Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Saint Leger, O. de
Place of Publication	Freiburg-im-Breisgau
Publisher	EuroSimE
Pages	463-466
Number of pages	4
ISBN (Print)	978-1-4244-2127-5
Publication status	Published - 2008
Event	9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - Freiburg-im-Breisgau Duration: 21 Apr 2008 → 23 Apr 2008

Publication series

Name
Publisher	EuroSimE

Conference

Conference	9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Period	21/04/08 → 23/04/08

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

Saraswat, MK., Jansen, KMB., Patel, MD., Ernst, LJ., Bohm, C., Kessler, A., Preu, H., & Stecher, M. (2008). A Characterization Method for Viscoelastic Bulk Modulus of Molding Compounds. In Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., & Saint Leger, O. de (Eds.), Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (pp. 463-466). EuroSimE.

Saraswat, MK ; Jansen, KMB ; Patel, MD et al. / A Characterization Method for Viscoelastic Bulk Modulus of Molding Compounds. Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. editor / Ernst, L.J. ; Zhang, G.Q. ; Driel, W.D. van ; Rodgers, P. ; Saint Leger, O. de. Freiburg-im-Breisgau : EuroSimE, 2008. pp. 463-466

@inproceedings{83f0bc1a65fa46efbc57cfa0aa5035bd,

title = "A Characterization Method for Viscoelastic Bulk Modulus of Molding Compounds",

abstract = "Reliability calculations of the microelectronic packages require cure dependent viscoelastic constitutive relationship for the packaging polymers in order to predict residual stress and strain fields in the final product. The residual stresses can result in the product failure due to warpage, interfacial delamination, thermal fatigue etc. The previous work in the same group (Ernst et al. 2006, 2003) towards complete viscoelastic model development was done using {"}approximate fully cure dependent{"} model in order to predict warpage of the QFN package. The relaxation shear modulus was accurately established but due to measurement limitation only estimated values of bulk modulus could be used. In the present work, a high pressure dilatometer (Gnomix PVT apparatus) was used to establish the time, temperature and pressure dependence of bulk modulus. The bulk modulus shows negligible time dependence which suggests that bulk modulus is not a viscoelastic but merely a temperature dependent linear elastic parameter. A material model for time, temperature and pressure dependency of the bulk Modulus is developed.",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "MK Saraswat and KMB Jansen and MD Patel and LJ Ernst and C Bohm and A Kessler and H Preu and M Stecher",

year = "2008",

language = "Undefined/Unknown",

isbn = "978-1-4244-2127-5",

publisher = "EuroSimE",

pages = "463--466",

editor = "{Ernst, L.J.} and {Zhang, G.Q.} and {Driel, W.D. van} and {Rodgers, P.} and {Saint Leger, O. de}",

booktitle = "Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems",

note = "9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems ; Conference date: 21-04-2008 Through 23-04-2008",

}

Saraswat, MK, Jansen, KMB, Patel, MD, Ernst, LJ, Bohm, C, Kessler, A, Preu, H & Stecher, M 2008, A Characterization Method for Viscoelastic Bulk Modulus of Molding Compounds. in Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds), Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. EuroSimE, Freiburg-im-Breisgau, pp. 463-466, 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 21/04/08.

A Characterization Method for Viscoelastic Bulk Modulus of Molding Compounds. / Saraswat, MK; Jansen, KMB; Patel, MD et al.
Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. ed. / Ernst, L.J.; Zhang, G.Q.; Driel, W.D. van; Rodgers, P.; Saint Leger, O. de. Freiburg-im-Breisgau: EuroSimE, 2008. p. 463-466.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

TY - GEN

T1 - A Characterization Method for Viscoelastic Bulk Modulus of Molding Compounds

AU - Saraswat, MK

AU - Jansen, KMB

AU - Patel, MD

AU - Ernst, LJ

AU - Bohm, C

AU - Kessler, A

AU - Preu, H

AU - Stecher, M

PY - 2008

Y1 - 2008

N2 - Reliability calculations of the microelectronic packages require cure dependent viscoelastic constitutive relationship for the packaging polymers in order to predict residual stress and strain fields in the final product. The residual stresses can result in the product failure due to warpage, interfacial delamination, thermal fatigue etc. The previous work in the same group (Ernst et al. 2006, 2003) towards complete viscoelastic model development was done using "approximate fully cure dependent" model in order to predict warpage of the QFN package. The relaxation shear modulus was accurately established but due to measurement limitation only estimated values of bulk modulus could be used. In the present work, a high pressure dilatometer (Gnomix PVT apparatus) was used to establish the time, temperature and pressure dependence of bulk modulus. The bulk modulus shows negligible time dependence which suggests that bulk modulus is not a viscoelastic but merely a temperature dependent linear elastic parameter. A material model for time, temperature and pressure dependency of the bulk Modulus is developed.

AB - Reliability calculations of the microelectronic packages require cure dependent viscoelastic constitutive relationship for the packaging polymers in order to predict residual stress and strain fields in the final product. The residual stresses can result in the product failure due to warpage, interfacial delamination, thermal fatigue etc. The previous work in the same group (Ernst et al. 2006, 2003) towards complete viscoelastic model development was done using "approximate fully cure dependent" model in order to predict warpage of the QFN package. The relaxation shear modulus was accurately established but due to measurement limitation only estimated values of bulk modulus could be used. In the present work, a high pressure dilatometer (Gnomix PVT apparatus) was used to establish the time, temperature and pressure dependence of bulk modulus. The bulk modulus shows negligible time dependence which suggests that bulk modulus is not a viscoelastic but merely a temperature dependent linear elastic parameter. A material model for time, temperature and pressure dependency of the bulk Modulus is developed.

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 978-1-4244-2127-5

SP - 463

EP - 466

BT - Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

A2 - Ernst, L.J., null

A2 - Zhang, G.Q., null

A2 - Driel, W.D. van, null

A2 - Rodgers, P., null

A2 - Saint Leger, O. de, null

PB - EuroSimE

CY - Freiburg-im-Breisgau

T2 - 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

Y2 - 21 April 2008 through 23 April 2008

ER -

Saraswat MK, Jansen KMB, Patel MD, Ernst LJ, Bohm C, Kessler A et al. A Characterization Method for Viscoelastic Bulk Modulus of Molding Compounds. In Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Saint Leger, O. de, editors, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Freiburg-im-Breisgau: EuroSimE. 2008. p. 463-466