A facile method to prepare oriented boron nitride-based polymer composite with enhanced thermal conductivity and mechanical properties

Jing Chen, Xu Liu, Xiao Liang Zeng*, Huai Yu Ye, Guo Qi Zhang

*Corresponding author for this work

Research output: Contribution to journalArticleScientificpeer-review

Abstract

Hexagonal boron nitride (BN) is often used as filler to improve the thermal conductivity of polymer matrix due to its high thermal conductivity. However, previously reported BN-based composites always have a high in-plane thermal conductivity, which is not beneficial for vertical heat dissipation. In addition, high BN content results in the deterioration of the mechanical properties. Here, we report a feasible method to prepare a BN/silicone rubber (SiR) composite with oriented BN in organosilicon matrix via a vacuum-assisted self-assembly technique. The BN/SiR composite displays a 1270% higher (2.74 W/(m·K)) thermal conductivity than that of neat organosilicon matrix (0.20 W/(m·K)). The oriented BN nanosheets increase the polymer's adhesive force and exhibit excellent compression cycle performance. In turn, these features support its superiority as thermal interface material in the light-emitting diode chips heat dissipation application.

Original languageEnglish
Article number101038
JournalComposites Communications
Volume29
DOIs
Publication statusPublished - 2022

Keywords

  • Boron nitride
  • Mechanical property
  • Polymer composites
  • Thermal conductivity
  • Vacuum-assisted self-assembly method

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