A fully-parameterized FEM model for electromagnetic optimization of an RF-MEMS wafer-level package

J Iannacci, J Tian, R Gaddi, A Gnudi, M Bartek

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	Proc. Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2007)
Editors	s.n.
Place of Publication	Stresa
Publisher	TIMA
Pages	1-6
Number of pages	6
Publication status	Published - 2007
Event	Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2007) - Stresa Duration: 25 Apr 2007 → 27 Apr 2007

Name
Publisher	TIMA

Conference	Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2007)
Period	25/04/07 → 27/04/07

Keywords

@inproceedings{b3d450f5964e49919a2e26cab727c8ff,

title = "A fully-parameterized FEM model for electromagnetic optimization of an RF-MEMS wafer-level package",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "J Iannacci and J Tian and R Gaddi and A Gnudi and M Bartek",

year = "2007",

language = "Undefined/Unknown",

publisher = "TIMA",

pages = "1--6",

editor = "s.n.",

booktitle = "Proc. Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2007)",

note = "null ; Conference date: 25-04-2007 Through 27-04-2007",

}

Iannacci, J, Tian, J, Gaddi, R, Gnudi, A & Bartek, M 2007, A fully-parameterized FEM model for electromagnetic optimization of an RF-MEMS wafer-level package. in s.n. (ed.), Proc. Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2007). TIMA, Stresa, pp. 1-6, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2007), 25/04/07.

Proc. Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2007). ed. / s.n. Stresa : TIMA, 2007. p. 1-6.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - A fully-parameterized FEM model for electromagnetic optimization of an RF-MEMS wafer-level package

AU - Iannacci, J

AU - Tian, J

AU - Gaddi, R

AU - Gnudi, A

AU - Bartek, M

PY - 2007

Y1 - 2007

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SP - 1

EP - 6

BT - Proc. Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2007)

A2 - s.n., null

PB - TIMA

CY - Stresa

Y2 - 25 April 2007 through 27 April 2007

ER -