Abstract
Microprocessors and SoCs employ multiple temperature sensors to prevent overheating and ensure reliable operation. Such sensors should be small (<10,000μm2) to monitor local hot-spots in dense layouts. They should also be moderately accurate (1°C) up to high temperatures (≥125°C), so that the system throttling temperature can be set as close as possible to the maximum allowable die temperature. Furthermore, they should be fast (1kS/s) and consume low power (tens of μW).
Original language | English |
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Title of host publication | 2021 IEEE International Solid-State Circuits Conference, ISSCC 2021 - Digest of Technical Papers |
Publisher | Institute of Electrical and Electronics Engineers (IEEE) |
Pages | 76-78 |
Number of pages | 3 |
ISBN (Electronic) | 9781728195490 |
DOIs | |
Publication status | Published - 2021 |
Event | 2021 IEEE International Solid-State Circuits Conference, ISSCC 2021 - San Francisco, United States Duration: 13 Feb 2021 → 22 Feb 2021 |
Publication series
Name | Digest of Technical Papers - IEEE International Solid-State Circuits Conference |
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Volume | 64 |
ISSN (Print) | 0193-6530 |
Conference
Conference | 2021 IEEE International Solid-State Circuits Conference, ISSCC 2021 |
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Country/Territory | United States |
City | San Francisco |
Period | 13/02/21 → 22/02/21 |
Bibliographical note
Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-careOtherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.