A methodology for early exploration of TSV placement topologies in 3D stacked ICs

R Jagtap, SS Kumar, TGRM van Leuken

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

8 Citations (Scopus)
Original languageEnglish
Title of host publication15th Euromicro conference on digital system design
Place of PublicationPiscataway, NJ, USA
PublisherIEEE Society
Pages382-388
Number of pages7
ISBN (Print)978-1-4673-2498-4
DOIs
Publication statusPublished - 2012
Event15th Euromicro conference on digital system design - Piscataway, NJ, USA
Duration: 5 Sep 20128 Sep 2012

Publication series

Name
PublisherIEEE

Conference

Conference15th Euromicro conference on digital system design
Period5/09/128/09/12

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