A micro-mechanics approach for polymeric material failures in microelectronic packaging

XJ Fan; GQ Zhang; LJ Ernst

A micro-mechanics approach for polymeric material failures in microelectronic packaging

XJ Fan, GQ Zhang, LJ Ernst

Dynamics of Micro and Nano Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	3rd international conference on benefiting from thermal and mechanical simulation in (micro)-electronics
Editors	LJ Ernst, GQ Zhang, R Dudek, O de Saint Leger
Place of Publication	Piscataway
Publisher	IEEE
Pages	154-164
Number of pages	11
ISBN (Print)	0-78-3-9819-X
Publication status	Published - 2002
Event	Conference ESIME 2002, Paris - Piscataway Duration: 15 Apr 2002 → 17 Apr 2002

Publication series

Name
Publisher	IEEE

Conference

Conference	Conference ESIME 2002, Paris
Period	15/04/02 → 17/04/02

Keywords

Conf.proc. > 3 pag

Cite this

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title = "A micro-mechanics approach for polymeric material failures in microelectronic packaging",

keywords = "Conf.proc. > 3 pag",

author = "XJ Fan and GQ Zhang and LJ Ernst",

year = "2002",

language = "Undefined/Unknown",

isbn = "0-78-3-9819-X",

publisher = "IEEE",

pages = "154--164",

editor = "LJ Ernst and GQ Zhang and R Dudek and {de Saint Leger}, O",

booktitle = "3rd international conference on benefiting from thermal and mechanical simulation in (micro)-electronics",

address = "United States",

note = "Conference ESIME 2002, Paris ; Conference date: 15-04-2002 Through 17-04-2002",

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A micro-mechanics approach for polymeric material failures in microelectronic packaging. / Fan, XJ; Zhang, GQ; Ernst, LJ.
3rd international conference on benefiting from thermal and mechanical simulation in (micro)-electronics. ed. / LJ Ernst; GQ Zhang; R Dudek; O de Saint Leger. Piscataway: IEEE, 2002. p. 154-164.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - A micro-mechanics approach for polymeric material failures in microelectronic packaging

AU - Fan, XJ

AU - Zhang, GQ

AU - Ernst, LJ

PY - 2002

Y1 - 2002

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-78-3-9819-X

SP - 154

EP - 164

BT - 3rd international conference on benefiting from thermal and mechanical simulation in (micro)-electronics

A2 - Ernst, LJ

A2 - Zhang, GQ

A2 - Dudek, R

A2 - de Saint Leger, O

PB - IEEE

CY - Piscataway

T2 - Conference ESIME 2002, Paris

Y2 - 15 April 2002 through 17 April 2002

ER -