A Micro-Power Temperature-to-Digital Converter for Use in a MEMS-Based 32 kHz Oscillator

S Zaliasl; J Salvia; T Fiez; KAA Makinwa; A Partridge; V Menon

doi:10.1007/978-3-319-21185-5_4

A Micro-Power Temperature-to-Digital Converter for Use in a MEMS-Based 32 kHz Oscillator

S Zaliasl, J Salvia, T Fiez, KAA Makinwa, A Partridge, V Menon

Electronic Instrumentation

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Abstract

This paper describes the design of a low-power energy-efficient temperature-to-digital converter (TDC) intended for the temperature compensation of a 32 kHz MEMS-based oscillator (TCXO). The compensation scheme enables a frequency stability of ±3 ppm over temperatures ranging from −40 to 85 °C. The TDC consists of an NPN-based temperature sensing element and a 15-bit second order ΔΣ modulator. A novel dynamic element matching (DEM) scheme ensures that DEM tones do not inter-modulate with the modulator’s bit-stream, thus improving the TDC’s accuracy without impacting its resolution. The TDC occupies 0.085 mm2 in a 180 nm CMOS process, draws less than 4.5 μA from a 1.5 to 3.3 V supply, and achieves a resolution of 25 mK in a conversion time of 6 ms. This corresponds to a figure of merit of 24 pJ°C2.

Original language	English
Title of host publication	Efficient Sensor Interfaces, Advanced Amplifiers and Low Power RF Systems
Subtitle of host publication	Advances in Analog Circuit Design 2015
Editors	KAA Makinwa, A Baschirotto, P Harpe
Place of Publication	Cham
Publisher	Springer
Pages	65-79
Number of pages	15
Volume	1
ISBN (Electronic)	978-3-319-21185-5
ISBN (Print)	978-3-319-21184-8
DOIs	https://doi.org/10.1007/978-3-319-21185-5_4
Publication status	Published - 2015
Event	AACD 2015, Neuchatel, Switzerland - Dordrecht Duration: 21 Apr 2015 → 23 Apr 2015

Conference

Conference	AACD 2015, Neuchatel, Switzerland
Period	21/04/15 → 23/04/15

Access to Document

10.1007/978-3-319-21185-5_4

Cite this

Zaliasl, S., Salvia, J., Fiez, T., Makinwa, KAA., Partridge, A., & Menon, V. (2015). A Micro-Power Temperature-to-Digital Converter for Use in a MEMS-Based 32 kHz Oscillator. In KAA. Makinwa, A. Baschirotto, & P. Harpe (Eds.), Efficient Sensor Interfaces, Advanced Amplifiers and Low Power RF Systems: Advances in Analog Circuit Design 2015 (Vol. 1, pp. 65-79). Springer. https://doi.org/10.1007/978-3-319-21185-5_4

@inproceedings{dded100f7d2b4748ab60312e5e21f9e1,

title = "A Micro-Power Temperature-to-Digital Converter for Use in a MEMS-Based 32 kHz Oscillator",

abstract = "This paper describes the design of a low-power energy-efficient temperature-to-digital converter (TDC) intended for the temperature compensation of a 32 kHz MEMS-based oscillator (TCXO). The compensation scheme enables a frequency stability of ±3 ppm over temperatures ranging from −40 to 85 °C. The TDC consists of an NPN-based temperature sensing element and a 15-bit second order ΔΣ modulator. A novel dynamic element matching (DEM) scheme ensures that DEM tones do not inter-modulate with the modulator{\textquoteright}s bit-stream, thus improving the TDC{\textquoteright}s accuracy without impacting its resolution. The TDC occupies 0.085 mm2 in a 180 nm CMOS process, draws less than 4.5 μA from a 1.5 to 3.3 V supply, and achieves a resolution of 25 mK in a conversion time of 6 ms. This corresponds to a figure of merit of 24 pJ°C2.",

author = "S Zaliasl and J Salvia and T Fiez and KAA Makinwa and A Partridge and V Menon",

year = "2015",

doi = "10.1007/978-3-319-21185-5_4",

language = "English",

isbn = "978-3-319-21184-8",

volume = "1",

pages = "65--79",

editor = "KAA Makinwa and A Baschirotto and P Harpe",

booktitle = "Efficient Sensor Interfaces, Advanced Amplifiers and Low Power RF Systems",

publisher = "Springer",

note = "AACD 2015, Neuchatel, Switzerland ; Conference date: 21-04-2015 Through 23-04-2015",

}

Zaliasl, S, Salvia, J, Fiez, T, Makinwa, KAA, Partridge, A & Menon, V 2015, A Micro-Power Temperature-to-Digital Converter for Use in a MEMS-Based 32 kHz Oscillator. in KAA Makinwa, A Baschirotto & P Harpe (eds), Efficient Sensor Interfaces, Advanced Amplifiers and Low Power RF Systems: Advances in Analog Circuit Design 2015. vol. 1, Springer, Cham, pp. 65-79, AACD 2015, Neuchatel, Switzerland, 21/04/15. https://doi.org/10.1007/978-3-319-21185-5_4

A Micro-Power Temperature-to-Digital Converter for Use in a MEMS-Based 32 kHz Oscillator. / Zaliasl, S; Salvia, J; Fiez, T et al.
Efficient Sensor Interfaces, Advanced Amplifiers and Low Power RF Systems: Advances in Analog Circuit Design 2015. ed. / KAA Makinwa; A Baschirotto; P Harpe. Vol. 1 Cham: Springer, 2015. p. 65-79.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - A Micro-Power Temperature-to-Digital Converter for Use in a MEMS-Based 32 kHz Oscillator

AU - Zaliasl, S

AU - Salvia, J

AU - Fiez, T

AU - Makinwa, KAA

AU - Partridge, A

AU - Menon, V

PY - 2015

Y1 - 2015

N2 - This paper describes the design of a low-power energy-efficient temperature-to-digital converter (TDC) intended for the temperature compensation of a 32 kHz MEMS-based oscillator (TCXO). The compensation scheme enables a frequency stability of ±3 ppm over temperatures ranging from −40 to 85 °C. The TDC consists of an NPN-based temperature sensing element and a 15-bit second order ΔΣ modulator. A novel dynamic element matching (DEM) scheme ensures that DEM tones do not inter-modulate with the modulator’s bit-stream, thus improving the TDC’s accuracy without impacting its resolution. The TDC occupies 0.085 mm2 in a 180 nm CMOS process, draws less than 4.5 μA from a 1.5 to 3.3 V supply, and achieves a resolution of 25 mK in a conversion time of 6 ms. This corresponds to a figure of merit of 24 pJ°C2.

AB - This paper describes the design of a low-power energy-efficient temperature-to-digital converter (TDC) intended for the temperature compensation of a 32 kHz MEMS-based oscillator (TCXO). The compensation scheme enables a frequency stability of ±3 ppm over temperatures ranging from −40 to 85 °C. The TDC consists of an NPN-based temperature sensing element and a 15-bit second order ΔΣ modulator. A novel dynamic element matching (DEM) scheme ensures that DEM tones do not inter-modulate with the modulator’s bit-stream, thus improving the TDC’s accuracy without impacting its resolution. The TDC occupies 0.085 mm2 in a 180 nm CMOS process, draws less than 4.5 μA from a 1.5 to 3.3 V supply, and achieves a resolution of 25 mK in a conversion time of 6 ms. This corresponds to a figure of merit of 24 pJ°C2.

U2 - 10.1007/978-3-319-21185-5_4

DO - 10.1007/978-3-319-21185-5_4

M3 - Conference contribution

SN - 978-3-319-21184-8

VL - 1

SP - 65

EP - 79

BT - Efficient Sensor Interfaces, Advanced Amplifiers and Low Power RF Systems

A2 - Makinwa, KAA

A2 - Baschirotto, A

A2 - Harpe, P

PB - Springer

CY - Cham

T2 - AACD 2015, Neuchatel, Switzerland

Y2 - 21 April 2015 through 23 April 2015

ER -

Zaliasl S, Salvia J, Fiez T, Makinwa KAA, Partridge A, Menon V. A Micro-Power Temperature-to-Digital Converter for Use in a MEMS-Based 32 kHz Oscillator. In Makinwa KAA, Baschirotto A, Harpe P, editors, Efficient Sensor Interfaces, Advanced Amplifiers and Low Power RF Systems: Advances in Analog Circuit Design 2015. Vol. 1. Cham: Springer. 2015. p. 65-79 doi: 10.1007/978-3-319-21185-5_4

A Micro-Power Temperature-to-Digital Converter for Use in a MEMS-Based 32 kHz Oscillator

Abstract

Conference

Access to Document

Fingerprint

Cite this